Multi-Layer Circuit Board Pre-Packaging Electrical Testing
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Solution Overview
Problem
Conventional multi-layer circuit boards cannot be tested for electrical properties before packaging, leading to time-consuming and labor-intensive troubleshooting of unqualified results, with unclear responsibilities for defects.
Innovation Solution
A manufacturing method for a multi-layer circuit board that allows for electrical testing by incorporating a conductive corrosion-barrier layer and electroplating processes to form a structure enabling pre-packaging testing, reducing costs and clarifying defect responsibilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-layer circuit boards are manufactured without pre-packaging testing capability, then manufacturing process is simpler, but electrical testing cannot be performed before packaging leading to time-consuming troubleshooting and unclear defect responsibilities
Solution Approach 1:
The patent applies preliminary action by incorporating test pads and test structures into the circuit board during the manufacturing process, before packaging. This allows electrical testing to be performed on the bare circuit board to verify connectivity and detect defects early, eliminating the need for post-packaging troubleshooting. The test structures are built into the board layout during manufacturing, enabling pre-packaging electrical verification.
Solution Approach 2:
The patent uses test pads as intermediary elements that facilitate electrical testing. These test pads are specifically designed contact points on the circuit board that allow external testing equipment to probe and verify electrical connectivity between different components and layers. The test pads serve as mediators between the circuit board internal structures and external testing equipment, enabling non-destructive electrical verification before packaging.
2Loss of time
If electrical testing is performed after packaging, then product structure is simpler, but time and labor are required to identify defect locations and responsibilities
Solution Approach 1:
The patent performs electrical testing before packaging by incorporating test pads and test structures into the manufacturing process. This preliminary testing action identifies defects early when the circuit board is still accessible, eliminating time-consuming post-packaging troubleshooting. Any electrical connectivity issues are detected and resolved before the component is sealed in its final packaged form.
Solution Approach 2:
The circuit board is designed with self-testing capability through integrated test pads and test structures that enable automated electrical verification during manufacturing. The board essentially tests itself for connectivity and electrical integrity before leaving the manufacturing line, reducing the need for manual post-packaging diagnostic work and quickly identifying defect locations.
3Measurement precision
If test structures are added to enable pre-packaging electrical testing, then defect detection capability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the test structures with the existing circuit board manufacturing process. Test pads are incorporated into the same PCB fabrication steps as the functional circuit traces, using the same copper layer deposition and patterning processes. This integration means that while testing capability is added, the manufacturing process itself doesn't require separate dedicated test structure fabrication steps, minimizing the increase in manufacturing complexity.
Solution Approach 2:
The test pads and test structures serve multiple functions: they enable electrical connectivity testing, provide component identification references, and can be used for future rework or repair operations. This multi-functionality means that the same structural elements serve both testing purposes and potential maintenance purposes, maximizing the value added while minimizing the manufacturing burden.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient pre-packaging electrical testing of multi-layer circuit boards, improving product quality assessment and reducing the time and labor required to identify and address defects.
Implementation Method 1
forming a second loading plate overlapping on the metal interface layer by electroplating the first loading plate
Data Source
AI summary
A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.