Multilayer Metal Circuit Structure for Oxidation-Safe Hybrid Bond Testing
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Solution Overview
Problem
Conventional semiconductor packaging methods, such as chip on film (COF), chip on glass (COG), and chip on plastic (COP), are insufficient to meet the increasing demands for higher precision and smaller sizes due to the shrinking size of semiconductor devices, necessitating more advanced packaging techniques.
Innovation Solution
A semiconductor structure with multiple metal circuit layers, where the topmost layer is made of aluminum with a concave shape and the remaining layers and contact posts are made of copper, allowing for electrical testing of the aluminum layer without oxidation and enabling hybrid bond contacts for improved component density and reduced volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging methods (COF, COG, COP) are used, then manufacturing simplicity is maintained, but precision and size requirements cannot be met
Solution Approach 1:
The invention divides the metal circuit layers into different material zones: the topmost layer is aluminum while underlying layers are copper. This segmentation allows the aluminum layer to be exposed for testing without oxidizing the copper layers, achieving both high precision and controlled complexity
Solution Approach 2:
Different regions of the metal circuit structure use different materials locally - aluminum at the top surface for oxidation resistance and testing, copper in deeper layers for conductivity. This local quality differentiation enables the structure to meet both precision requirements and manufacturing feasibility
2Reliability
If copper is used for all metal circuit layers, then electrical conductivity is optimized, but oxidation occurs during testing preventing reliable quality assurance
Solution Approach 1:
The aluminum layer serves as an intermediary protective layer on top of the copper layers. It prevents direct exposure of copper to oxygen during testing, eliminating oxidation issues while allowing electrical properties to be tested on the aluminum surface
Solution Approach 2:
The invention uses a composite material structure combining aluminum and copper layers. The aluminum-copper composite leverages aluminum's oxidation resistance for surface exposure and testing, while copper provides superior electrical conductivity in the embedded layers, resolving both reliability and harmful oxidation factors
3Ease of manufacture
If all metal layers are made of the same material, then manufacturing process is simplified, but testing must be performed in controlled environments preventing oxidation
Solution Approach 1:
The metal circuit structure is segmented into aluminum top layer and copper underlying layers. This segmentation allows the aluminum layer to be deposited and exposed for testing without requiring oxidation-preventive measures, while copper layers remain protected, simplifying the overall manufacturing environment
Solution Approach 2:
Different materials are assigned to different local positions based on functional requirements - aluminum at the exposed surface for oxidation resistance and testing accessibility, copper in protected positions for conductivity. This local differentiation enables ease of manufacture without controlled environments while preventing oxidation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable electrical testing of the multi-layer metal circuit layers, ensuring specifications are met before forming hybrid bond contacts, thereby enhancing the precision and efficiency of semiconductor packaging.
Implementation Method 1
Because aluminum is less prone to oxidation reaction when it exposed in the air
Data Source
AI summary
The invention provides a semiconductor structure, which comprises a plurality of metal circuit layers stacked with each other, the multi-layer metal circuit layer comprises an aluminum circuit layer which is located at the position closest to a surface among the plurality of circuit layers, the material of the aluminum circuit layer is made of aluminum, and the aluminum circuit layer comprises a concave portion.