Multilayer Coil Layout for 50 GHz High-Frequency Performance
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Solution Overview
Problem
Existing multilayer inductors lack sufficient high-frequency characteristics at GHz bands above 50 GHz, particularly in electrical devices where communication speed and size are increasing.
Innovation Solution
A multilayer coil component design featuring insulating layers laminated in the length direction with coil conductors, where the distance between adjacent coil conductors is between 4 μm and 8 μm, and the width of the line portion is between 30 μm and 50 μm, with via conductors connecting land portions to improve high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multilayer inductor design is used, then manufacturing is simpler, but high-frequency characteristics at 50 GHz or more are insufficient
Solution Approach 1:
The patent applies parameter changes by optimizing specific dimensional parameters of the coil conductors: the distance between adjacent coil conductors is set to 4-8 μm, the line width is set to 30-50 μm, and the inner diameter is set to 50-100 μm. These parameter optimizations directly improve high-frequency characteristics at 50 GHz or more while maintaining the multilayer inductor structure.
Solution Approach 2:
The patent utilizes the lamination direction (length direction) as an additional dimension to arrange coil conductors with optimized spacing. By controlling the distance between coil conductors in the lamination direction to be 4-8 μm, the design achieves improved high-frequency characteristics through dimensional optimization in the stacking direction of the multilayer structure.
2Productivity
If the distance between coil conductors is reduced to increase density, then productivity improves, but high-frequency characteristics deteriorate
Solution Approach 1:
The patent identifies and optimizes the critical parameter of distance between coil conductors, setting it to 4-8 μm. This specific parameter range achieves the optimal balance between component density (productivity) and high-frequency characteristics, preventing both excessive spacing that would reduce density and insufficient spacing that would degrade high-frequency performance.
3Reliability
If the line width of coil conductors is increased to reduce resistance, then electrical conductivity improves, but the distance between adjacent conductors must be increased reducing density
Solution Approach 1:
The patent simultaneously optimizes two parameters: line width (30-50 μm) for electrical conductivity and distance between conductors (4-8 μm) for density. This coordinated parameter change achieves the optimal balance between reducing resistance through wider lines and maintaining high component density through compact spacing, resolving the trade-off between conductivity and productivity.
Data Source
AI summary
A multilayer coil component includes a multilayer body that contain a coil. The coil includes coil conductors. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a first main surface. A distance between the coil conductors adjacent to each other in the lamination direction is from 4 μm to 8 μm. Each coil conductor includes a line portion and a land portion that is disposed at an end portion of the line portion. The land portions of the coil conductors adjacent to each other in the lamination direction are connected to each other with a via conductor interposed therebetween. A width of the line portion is from 30 μm to 50 μm. An inner diameter of each coil conductor is from 50 μm to 100 μm.