Multilayer Coil Component With Accommodation Space For Magnetic Resin Filling

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Solution Overview

Problem

The existing multilayer coil components face difficulties in filling the entire through-hole with magnetic resin, leading to unfilled spaces that can reduce the component's characteristics due to insufficient magnetic resin volume.

Innovation Solution

Incorporating an adhesive resin layer with an accommodation space connected to the through-hole, allowing the magnetic resin to overflow and fill the entire volume, ensuring a maximum filling amount by combining the volume of the through-hole and the accommodation space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If magnetic resin is filled into the through-hole during manufacturing, then the magnetic resin volume increases, but unfilled spaces remain inside the through-hole due to difficulty in complete filling

Engineering Contradiction:
Improvemagnetic resin volumeVSAvoidfilling completeness
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The invention extends the through-hole structure into a third dimension by creating an accommodation space that protrudes from the multilayer body surface. This dimensional extension provides additional volume for magnetic resin accommodation, ensuring complete filling without leaving unfilled spaces while maintaining manufacturing feasibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The accommodation space acts as an intermediary structure between the through-hole and the external environment. It serves as a buffer zone that facilitates complete magnetic resin filling by providing additional space that compensates for manufacturing variations and ensures the through-hole is fully filled.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the filling amount of magnetic resin varies due to manufacturing errors, then the magnetic resin may not fill the entire through-hole, but the accommodation space allows the magnetic resin to escape and ensures complete filling

Engineering Contradiction:
Improvefilling consistencyVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The accommodation space is designed beforehand as a cushioning volume that compensates for potential manufacturing variations. This pre-designed space ensures that even if the filling amount varies, the magnetic resin will still completely fill the through-hole by having extra space to accommodate the variation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Manufacturing precision

If the outer edge of the accommodation space is located on the outer side of the through-hole, then the magnetic resin can be completely filled, but the adhesive resin layer must be positioned precisely

Engineering Contradiction:
Improvemagnetic resin filling completenessVSAvoidalignment difficulty
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The adhesive resin layer is applied locally at the bottom surface of the accommodation space, which is positioned on the outer side of the through-hole. This local positioning allows the magnetic resin to be completely filled into the through-hole while the adhesive resin layer provides precise local adhesion without requiring extensive alignment across the entire structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures that the magnetic resin fills the entire through-hole, reducing the likelihood of unfilled spaces and enhancing the component's characteristics, such as inductance value, by providing a suitable volume and secure adhesion between layers.

Implementation Method 1

a magnetic substrate adhered to the multilayer body with the adhesive resin layer interposed therebetween

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20230178294A1Multilayer coil component
Publication Date: 2023.06.08 MURATA MFG CO LTD
  • US20230178294A1 patent drawing
  • US20230178294A1 patent drawing
  • US20230178294A1 patent drawing

AI summary

In a multilayer coil component, a multilayer body includes a plurality of insulator layers and a through-hole. The through-hole penetrates in a third positive direction. A first coil extends inside the multilayer body while surrounding an outer circumference of the through-hole. A magnetic resin is filled into the through-hole. An overlying adhesive resin layer is laminated on a first surface of the multilayer body. An upper magnetic substrate is adhered to the multilayer body with the overlying adhesive resin layer interposed therebetween. The overlying adhesive resin layer includes an accommodation space. The accommodation space is connected to the through-hole. When the multilayer coil component is seen in the third positive direction, an outer edge of the accommodation space is located on an outer side of an outer edge of the through-hole. A portion of the magnetic resin is located inside the accommodation space.