Multilayer Coil Structure With Aligned Vias for Interlayer Insulation

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Solution Overview

Problem

Traditional semiconductor machining coils face challenges in insulation due to increased layers, leading to potential interlayer short circuits and reduced electromagnetic performance, which affects accuracy, stability, and reliability.

Innovation Solution

A multi-layer coil structure with aligned via holes between adjacent subcoils filled with conductive material, ensuring electrical contact and staggered hole arrangement to prevent short circuits, allowing for more turns within the same product height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of coil layers is increased to achieve more turns, then the electromagnetic conversion efficiency is improved, but the risk of interlayer short circuits increases due to insulation difficulties

Engineering Contradiction:

Improvenumber of coil turnsVSAvoidinterlayer insulation reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The coil structure is segmented into multiple subcoils, each with its own insulating film and through holes. This segmentation allows for better insulation management between layers while maintaining the overall multi-turn functionality, resolving the contradiction between increasing turns and maintaining insulation reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulating film is introduced as an intermediary layer between adjacent subcoils. This insulating film with through holes serves as a mediator that enables electrical connection between layers while preventing direct contact and potential short circuits, thus maintaining insulation reliability while allowing increased coil turns

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the insulation layer thickness is increased to prevent short circuits, then the insulation reliability is improved, but the electromagnetic performance and heat dissipation efficiency are reduced

Engineering Contradiction:

Improveinsulation reliabilityVSAvoidelectromagnetic performance and heat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

Instead of uniformly increasing insulation thickness throughout, the insulating film is applied locally between subcoils with through holes positioned at specific locations. This localized insulation approach provides necessary electrical isolation while minimizing the impact on electromagnetic performance and heat dissipation

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

A thin insulating film is used instead of thick insulation layers. The film provides sufficient electrical insulation to prevent short circuits while its thin profile minimizes interference with electromagnetic field distribution and heat dissipation pathways, resolving the contradiction between insulation reliability and energy efficiency

Inventive Principle:

Principle #30Flexible shells and thin films

3Volume of moving object

If the coil layers are closely arranged to improve electromagnetic conversion, then the space utilization is improved, but the insulation difficulty increases leading to potential short circuits

Engineering Contradiction:

Improvespace utilizationVSAvoidinsulation structure complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The insulating film and through hole structure are merged into an integrated design where the insulating film serves dual purposes: providing electrical isolation between closely arranged subcoils and facilitating electrical connection through its through holes. This merging simplifies the overall insulation structure while enabling close layer arrangement

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances insulation, increases the number of coil turns, and improves accuracy, stability, and reliability by allowing more layers in the same volume, accommodating various inductance values and applications.

Implementation Method 1

metal contacts are arranged in the via holes, so that the adjacent subcoils are in electrical contact with each other

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

an insulating film arranged on the bottom coil... Outer surfaces of the bottom coil and the top coil are both provided with an insulating layer

Methodology Applied

Scientific EffectElectrical Insulation: Electrical Resistance

Data Source

PatentUS20260066162A1Multi-layer coil structure, inductor, and method for manufacturing multilayer coil structure

Publication Date: 2026.03.05 INMICRO INTEGRATED MAGNETIC TECHNOLOGY CO LTD

AI summary

The present disclosure provides a multi-layer coil structure, an inductor, and a method for manufacturing the multi-layer coil structure. The multi-layer coil structure includes subcoils arranged in a stacked manner, where each subcoil includes a bottom coil, an insulating film, and a top coil, a contact is arranged in a through hole of the insulating film, outer surfaces of the bottom coil and the top coil are both provided with an insulating layer, and the insulating layer is provided with a via hole; via holes in adjacent subcoils are aligned with each other, and metal contacts are arranged in the via holes. The problem of insulation in a multi-layer multi-turn coil is solved.