Multilayer Coil Board Layout for Faster Short-Circuit Inspection
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Solution Overview
Problem
Conventional multilayer boards face challenges in detecting short-circuit failures efficiently, requiring extensive manual inspection of individual layers, which increases man-hours and complexity.
Innovation Solution
A multilayer board design with overlapping floating patterns and sequentially connected coil patterns allows for reduced measurement time by measuring electrical characteristics between floating and terminal patterns, enabling quick identification of failed components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional inspection methods are used to detect short-circuit failures in multilayer boards, then measurement accuracy is maintained, but the number of man-hours for measurement increases significantly
Solution Approach 1:
The patent applies preliminary action by pre-configuring test patterns (floating patterns and extension patterns) during the manufacturing stage. These patterns are built into the PCB structure before final assembly, allowing for automated electrical testing to quickly identify short-circuit locations without manual layer-by-layer inspection. This preliminary setup enables rapid fault detection while maintaining measurement accuracy.
2Measurement precision
If manual layer-by-layer inspection is performed to detect failures, then measurement precision is ensured, but device complexity increases due to extensive manual procedures
Solution Approach 1:
The patent replaces the mechanical manual inspection process with an electrical testing system. Instead of physically examining each layer manually, the invention uses electrical signals applied to test patterns to automatically detect short-circuits. This substitution maintains detection precision while significantly reducing process complexity and enabling automated inspection.
3Reliability
If extensive manual measurement is conducted across all layers, then complete fault detection is achieved, but loss of time increases proportionally with the number of layers
Solution Approach 1:
The patent applies segmentation by dividing the multilayer board into discrete testable segments through the use of floating patterns and extension patterns on specific layers. Each pattern acts as an independent test node that can be electrically probed to identify faults in specific layers or regions. This segmentation allows comprehensive fault detection across all layers while reducing total inspection time through targeted electrical testing rather than exhaustive manual examination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the number of man-hours required to detect failed components by stabilizing capacitive components and improving measurement accuracy, facilitating efficient fault detection.
Implementation Method 1
stabilizing capacitive components
Data Source
AI summary
A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.