Multilayer Coil Structure for Higher Conductor Volume
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Solution Overview
Problem
Miniaturization of coil components in electronic devices has led to challenges in maintaining the required inductance and other characteristics, as the total volume of conductors in conventional coil components is limited, restricting the improvement of component characteristics such as DC resistance.
Innovation Solution
The coil component design includes multiple coil layers with specific metal layer structures and bridge patterns, allowing for increased conductor volume by using lead-in wire plating and isotropic/anisotropic plating layers, which enhances the total volume of conductors within a limited body size, thereby improving component characteristics like DC resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If coil components are miniaturized to fit smaller electronic devices, then the size of the component is reduced, but the total volume of conductors is limited which restricts the improvement of component characteristics such as DC resistance
Solution Approach 1:
The patent applies dimensionality change by transitioning from planar coil patterns to three-dimensional vertically stacked coil layers. Multiple coil layers are formed at different heights on the substrate, with conductors extending in the thickness direction. This vertical stacking enables increased total conductor volume within a compact footprint, improving DC resistance characteristics while maintaining miniaturized component size.
Solution Approach 2:
The patent implements nesting by placing multiple coil layers within each other in the vertical direction. Each coil layer is nested above or below others, with insulating layers and support structures nested between them. This nested arrangement maximizes the utilization of available space, allowing greater conductor volume to be packed into a small component footprint while maintaining electrical isolation between layers.
2Quantity of substance
If the number of coil layers is increased to improve conductor volume, then the total volume of conductors increases, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies segmentation by dividing the coil structure into multiple discrete coil layers, each formed as a separate pattern on the substrate. Each coil layer can be independently designed and formed, with specific patterns optimized for their position in the stack. This segmentation allows systematic increase of conductor volume by adding layers while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The patent utilizes parameter changes by varying the formation parameters of different coil layers, including conductor thickness, pattern geometry, and spacing between layers. By adjusting these parameters across multiple layers, the total conductor volume is increased while optimizing electrical characteristics. The support substrate height and insulating layer thickness are also varied to accommodate the multi-layer structure.
3Reliability
If multiple metal layers are stacked to increase conductor volume, then the DC resistance characteristic is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary action by pre-forming the support substrate with integrated via holes and insulating structures before depositing the coil patterns. The support substrate is prepared in advance with through-holes for vertical conductor connections and embedded insulating layers. This preliminary preparation simplifies subsequent coil layer formation, as the structural framework is already in place to guide and support the multi-layer conductor deposition process.
Solution Approach 2:
The patent uses insulating layers as intermediary elements between adjacent metal coil layers. These insulating layers provide electrical isolation while mechanically supporting the conductor patterns. The intermediary insulating structures enable the stacking of multiple metal layers without direct shorting, facilitating increased conductor volume through vertical stacking while maintaining manufacturability through standardized insulation deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively increases the total volume of conductors, enhancing the characteristics of the coil component, such as DC resistance, while maintaining a compact size, thus addressing the limitations of conventional coil components.
Implementation Method 1
Each of the second and third coil layers comprises a first metal layer, disposed on the support substrate, and a second metal layer disposed on the first metal layer to cover a side surface of the first metal layer and to be in contact with the support substrate
Data Source
AI summary
A coil component includes a support substrate disposed in the body, a coil portion disposed on the support substrate and comprising first, second, third and fourth coil layers spaced apart from each other, and a first external electrode and a second external electrode disposed to be spaced apart from each other on the body and connected to the first and fourth coil layers, respectively. Each of the second and third coil layers comprises a first metal layer, disposed on the support substrate, and a second metal layer disposed on the first metal layer to cover a side surface of the first metal layer and to be in contact with the support substrate. The second coil layer has a first bridge pattern exposed to a first side surface of two side surfaces, opposing each other, of the body. The third coil layer has a second bridge pattern exposed to a second side surface of the two side surfaces of the body.