Multilayer Coil Layout With Exposed Vias for Core Size Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization and thinning of coil components lead to deteriorated magnetic characteristics due to insufficient core size and alignment issues with conductive vias, which complicates achieving the same performance as larger coil components.
Innovation Solution
A coil component design featuring an insulating layer with conductive vias that have partially exposed side surfaces, optimizing their arrangement and width to secure the core size while maintaining connectivity between coils, thereby enhancing magnetic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a via pad having a greater line width is formed to ensure alignment between conductive via and coil layers, then alignment precision is improved, but core size is reduced and magnetic characteristics deteriorate
Solution Approach 1:
The patent applies local quality by differentiating the treatment of via pads based on their position. Outer via pads have greater line widths to ensure alignment, while inner via pads have smaller line widths to preserve core size. This localized differentiation resolves the contradiction by optimizing each via pad's dimensions according to its specific functional requirements rather than applying a uniform design.
2Reliability
If the ratio of magnetic material in core is increased to maintain magnetic characteristics during miniaturization, then magnetic properties are improved, but frequency characteristics and insulation performance deteriorate
Solution Approach 1:
The patent applies local quality by creating regions with different magnetic material ratios within the core. The core is divided into a first region with a first magnetic material ratio and a second region with a second magnetic material ratio. This allows different portions of the core to be optimized for different functions: some regions prioritize magnetic characteristics while others maintain frequency characteristics and insulation performance.
Data Source
AI summary
A coil component includes a body, an insulating layer disposed in the body, at least one first coil disposed on a first surface of the insulating layer, at least one second coil disposed on a second surface of the insulating layer, a plurality of conductive vias connecting the at least one first coil and the at least one second coil, a first external electrode disposed on the body and connected to the at least one first coil; and a second external electrode disposed on the body and connected to the at least one second coil, wherein at least two conductive vias, among the plurality of conductive vias, include a plurality of side surfaces, respectively, and at least one side surface, among the plurality of side surfaces, is at least partially uncovered by and exposed from the insulating layer.