Multilayer Coil Fabrication With UV-Removable Holding Resin
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Solution Overview
Problem
The reliability and yield of multilayer coil components are compromised due to issues with coil conductor deviation and posture collapse during the manufacturing process, particularly caused by the removal of the holding layer during firing.
Innovation Solution
A method involving the use of a positive-type photoresist resin layer that is irradiated and developed without firing, followed by heat treatment and filling with a magnetic material to secure the coil conductors, ensuring they are not affected by binder removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the holding layer is removed by firing in the related art method, then the manufacturing process is simplified, but the coil conductor may deviate or collapse due to binder removal
Solution Approach 1:
The patent extracts the harmful function of the holding layer (causing conductor deviation through binder removal) while retaining its useful function (holding the coil conductor). This is achieved by replacing the photosensitive paste-based holding layer with a water-soluble polymer-based holding layer that can be removed without firing, thus eliminating the harmful effect while preserving the positioning function during manufacturing.
Solution Approach 2:
The patent changes the material parameters of the holding layer from photosensitive paste to water-soluble polymer, and changes the removal method from thermal firing to water washing. This parameter change allows the holding layer to be removed without the high-temperature firing process that causes binder removal and conductor deviation, thereby resolving the contradiction between manufacturing simplicity and conductor position stability.
2Reliability
If firing is used to remove the holding layer, then the insulating film and conductor are formed, but the coil conductor becomes problematic due to binder removal
Solution Approach 1:
The patent converts the harmful effect of holding layer removal into a beneficial process by using water-soluble polymer that can be easily washed away without causing conductor deviation. The water-soluble nature of the new holding layer material transforms the previously harmful binder removal process into a gentle water-based removal process that does not affect the coil conductor's position or integrity.
Solution Approach 2:
The patent replaces the thermal firing process (thermal system) with a water-based washing process (chemical system) for removing the holding layer. This substitution eliminates the high-temperature thermal effects that cause binder removal and conductor deviation, while still achieving the desired holding layer removal and insulating film formation.
3Ease of manufacture
If photosensitive paste is used for the holding layer, then the layer can be formed by photolithography, but the binder removal during firing causes conductor deviation
Solution Approach 1:
The patent uses a water-soluble polymer-based holding layer that is designed to be temporary and easily removable. This disposable holding layer serves its purpose of positioning the coil conductor during manufacturing, then can be easily washed away with water without causing any harmful effects, unlike the photosensitive paste that requires harmful firing for removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents coil conductor problems during manufacturing, enhancing the reliability and yield of multilayer coil components while allowing for reduced conductor spacing and improved insulation, thus reducing component size and improving characteristics.
Implementation Method 1
a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer
Implementation Method 2
the method may include a step of performing heat treatment on the conductor and the insulating film after removing the resin layer
Data Source
AI summary
A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.