Multilayer Coil Component Optimizing Inductance and Rigidity

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Solution Overview

Problem

High frequency inductors face challenges in achieving high inductance and low resistance while maintaining a small size, with existing technologies like thin film and winding type inductors being costly and limited in miniaturization, and multilayer type inductors facing issues with process stability and mechanical properties.

Innovation Solution

A multilayer coil electronic component with a body structure featuring outer and inner coil patterns, corner portions, and L-shaped external electrodes, which enhance inductance and reduce resistance by optimizing the shape and arrangement of coil patterns and electrodes to improve electrical and mechanical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a thin film type inductor is used, then manufacturing precision is improved, but manufacturing time increases and costs increase

Engineering Contradiction:
Improveinductor manufacturing precisionVSAvoidmanufacturing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The inductor is divided into multiple layers with inner coil patterns and outer coil patterns stacked in sequence. Each layer can be manufactured independently and then stacked, allowing parallel processing and reducing overall manufacturing time while maintaining precision through standardized layer structures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design transitions from a planar single-layer structure to a three-dimensional multilayer stacked structure. By utilizing the vertical dimension through multiple stacked layers, the inductor achieves higher inductance values and better electrical properties without increasing the planar footprint, thereby maintaining manufacturing precision while enabling more efficient production

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a winding type inductor is used, then manufacturing simplicity is improved, but miniaturization capability deteriorates

Engineering Contradiction:
Improveinductor manufacturing simplicityVSAvoidinductor size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The winding structure is segmented into discrete conductive patterns on separate layers rather than continuous winding. This allows the inductor to be manufactured using printed circuit board techniques which are simpler and more suitable for miniaturization, while the stacked layers maintain the necessary inductance characteristics

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design uses vertical stacking of multiple thin layers to achieve the required inductance in a compact volume. This three-dimensional arrangement replaces traditional horizontal winding, enabling miniaturization while maintaining manufacturing simplicity through standardized layer fabrication and stacking processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If a multilayer type inductor is used, then miniaturization is improved and process stability is improved, but mechanical rigidity deteriorates

Engineering Contradiction:
Improveprocess stabilityVSAvoidmechanical rigidity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The multilayer structure combines different materials with complementary properties: ferromagnetic powder cores provide magnetic properties and structural support, dielectric layers provide electrical insulation and mechanical stability, and conductive patterns provide electrical connectivity. This composite construction enhances overall mechanical rigidity while maintaining the benefits of miniaturization and process stability

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The design embeds multiple functional elements within a compact nested structure: inner coil patterns are nested within the body, outer coil patterns are nested on the exterior surfaces, and electrode patterns are nested to provide both electrical connection and mechanical support. This nested arrangement maximizes space utilization for miniaturization while the interlocking structure enhances mechanical rigidity

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS11476034B2Coil electronic component
Publication Date: 2022.10.18 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11476034B2 patent drawing
  • US11476034B2 patent drawing
  • US11476034B2 patent drawing

AI summary

A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.