Multilayer Coil Structure for Thin Profile and Insulation
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Solution Overview
Problem
Existing coil components, particularly thin-film types, face challenges in miniaturization and thickness reduction while maintaining effective electrical insulation and component characteristics, leading to increased complexity and potential short-circuits.
Innovation Solution
A coil component design featuring a coil portion with a first conductive layer embedded in the support portion, a second conductive layer disposed on the first layer, and a third conductive layer protruding from the support portion, utilizing a different metal for the second conductive layer to prevent conduction loss, and a lead portion connected via a via penetrating through the support portion, optimizing thickness and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the coil component is thinned to achieve miniaturization, then the thickness is reduced, but electrical insulation may be compromised and conduction loss increases
Solution Approach 1:
The patent employs a multi-layer conductive structure with different metal materials. The first conductive layer uses a first metal, the second conductive layer uses a second metal, and the third conductive layer uses a third metal. This composite material approach allows optimization of each layer's properties to maintain electrical insulation and reduce conduction loss while achieving thickness reduction.
Solution Approach 2:
The patent transitions from a conventional planar coil structure to a three-dimensional multi-layer structure. The coil portion includes conductive layers disposed at different heights and positions, with some layers embedded in the support portion and others protruding. This dimensional change allows for improved electrical insulation and reduced conduction loss within a thinner overall profile.
2Length of moving object
If the coil component is thinned to achieve miniaturization, then the thickness is reduced, but conduction loss increases
Solution Approach 1:
The patent employs a multi-layer conductive structure with different metal materials. The first conductive layer uses a first metal, the second conductive layer uses a second metal, and the third conductive layer uses a third metal. This composite material approach allows optimization of each layer's properties to maintain electrical insulation and reduce conduction loss while achieving thickness reduction.
Solution Approach 2:
The patent applies different metal materials to different conductive layers based on their specific functional requirements. Each layer can be optimized for its local function - for example, layers closer to the core may use materials with different properties than outer layers. This local quality approach minimizes conduction loss by ensuring each region has the optimal material properties.
3Reliability
If a multi-layer conductive structure is used to improve insulation and reduce loss, then the component characteristics are enhanced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the coil portion into multiple discrete conductive layers (first, second, and third conductive layers) that can be manufactured and assembled separately. Each layer serves a specific function and can be optimized independently. This segmentation allows for simplified manufacturing processes for each individual layer while achieving the overall performance benefits of a complex multi-layer structure.
Data Source
AI summary
A coil component includes a body, a support portion disposed in the body, a coil portion disposed on a first surface of the support portion, a lead portion disposed on a second surface of the support portion facing the first surface of the support portion and connected to the coil portion, and a via penetrating through the support portion to connect an inner end portion of the coil portion and an inner end portion of the lead portion to each other, wherein the coil portion includes a first conductive layer embedded in the support portion and having a first surface exposed to or facing the first surface of the support portion, a second conductive layer disposed on the first surface of the first conductive layer, and a third conductive layer disposed on the second conductive layer and protruding from the first surface of the support portion.