Multilayer Coil Component Insulation for Higher Withstand Voltage

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Solution Overview

Problem

Multilayer electronic components face issues with short circuits between coil conductors and between coil conductors and external electrodes, leading to reduced withstand voltage.

Innovation Solution

The use of a multilayer electronic component design featuring metal magnetic particles with a soft magnetic material, where the surfaces of these particles are covered with a first insulating portion, and at least one conductor has a second insulating portion with a greater thickness than the first, positioned between conductors to prevent short circuits, along with the inclusion of normal and flat-shaped particles to optimize particle distribution and reduce stray capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a thin insulating portion is used to cover metal magnetic particles, then the device complexity is reduced and manufacturing is easier, but the withstand voltage between conductors deteriorates leading to short circuits

Engineering Contradiction:
Improveease of manufactureVSAvoidwithstand voltage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies different insulating portion thicknesses at different locations: a first insulating portion with thickness T1 covers the metal magnetic particles, while a second insulating portion with greater thickness T2 (where T2 > T1) is provided between conductors. This local variation in thickness provides enhanced insulation where needed (between conductors) while maintaining overall manufacturing feasibility.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces a dimensional variation in the insulating portion thickness, creating a multi-level insulating structure. The second insulating portion extends beyond the first insulating portion in the thickness direction, forming a stepped configuration that provides additional insulation barrier between conductors without significantly increasing overall device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the insulating portion thickness is increased to prevent short circuits, then the withstand voltage between conductors is improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvewithstand voltageVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent provides enhanced insulation (second insulating portion with thickness T2) only in the specific region between conductors where short circuit risk exists, while maintaining thinner insulation (first insulating portion with thickness T1) in other areas. This localized approach improves withstand voltage without uniformly increasing device complexity throughout the entire structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies insulating material in a partial manner, providing the thicker second insulating portion only where needed between conductors rather than uniformly throughout. This partial action provides sufficient insulation to prevent short circuits while avoiding excessive material usage and reduced manufacturing efficiency.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses short circuits and enhances the withstand voltage between conductors, improving the reliability and performance of multilayer electronic components.

Implementation Method 1

Surfaces of the plurality of metal magnetic particles are covered by a first insulating portion having an insulating property

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a second insulating portion having an insulating property are disposed in at least a part of a surface of at least one conductor of the two conductors... a thickness of the second insulating portion is larger than a thickness of the first insulating portion

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS20240404740A1Multilayer electronic component
Publication Date: 2024.12.05 TDK CORP
  • US20240404740A1 patent drawing
  • US20240404740A1 patent drawing
  • US20240404740A1 patent drawing

AI summary

A multilayer coil component includes an element body that contains a plurality of metal magnetic particles made of a soft magnetic material, and at least two conductors that are in contact with the element body. Surfaces of the plurality of metal magnetic particles are covered by an oxide film having an insulating property, an insulating portion having an insulating property is formed in at least a part of a surface of at least one conductor of the two conductors in the conductor, and a thickness of the insulating portion is larger than a thickness of the oxide film.