Multilayer Coil Non-Overlapping Linear Conductors
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Solution Overview
Problem
Current multilayer coils face challenges in achieving an excellent Q characteristic, particularly for higher frequency applications, due to issues with floating capacitance and conductor overlap when viewed from the layer stacking direction.
Innovation Solution
A multilayer coil design featuring linear conductors with lengths corresponding to half a looped track, where one end of each conductor is connected to a via conductor and the other end does not overlap adjacent conductors when viewed from the layer stacking direction, reducing floating capacitance and optimizing the number of turns per insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If linear conductors are arranged to not overlap when viewed from the layer stacking direction to reduce floating capacitance, then Q characteristic is improved, but the number of turns per insulating layer is reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked arrangement by introducing via conductors that pierce through insulating layers. This allows linear conductors to be connected across multiple layers, effectively increasing the number of turns without requiring overlapping in the planar view, thus reducing floating capacitance while maintaining inductance.
Solution Approach 2:
The patent embeds via conductors within the insulating layers, creating a nested structure where conductive elements are integrated into the insulating matrix. This nesting allows the conductor path to continue through the layers without occupying additional planar space, enabling more turns to be achieved in the vertical dimension rather than requiring horizontal overlap.
2Reliability
If linear conductors are made longer to increase the number of turns, then inductance is improved, but floating capacitance between adjacent conductors increases
Solution Approach 1:
The patent resolves the conflict between inductance and floating capacitance by extending the conductor path into the vertical dimension through via conductors. This allows the inductance to be increased through additional turns in the stacked configuration while the planar projection of adjacent conductors remains non-overlapping, thereby minimizing floating capacitance despite the increased total conductor length.
3Productivity
If more insulating layers are added to accommodate more turns, then device complexity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent makes the insulating layers serve multiple functions: they provide electrical insulation between conductors, serve as structural support for via conductors, and act as alignment references for stacking. This multi-functionality reduces the need for separate alignment features and simplifies the manufacturing process, allowing higher precision to be achieved more easily.
Data Source
AI summary
A coil is provided at a multilayer body including insulating layers stacked on one another. The coil includes linear conductors connected by via conductors to make a looped track when viewed from a layer stacking direction. The linear conductors include a first linear conductor contacting with an external electrode provided on the surface of the multilayer body, and a second linear conductor forming a half of the looped track. The first linear conductor includes a coil portion forming a part of the looped track. The second linear conductor is adjacent to the first linear conductor with one of the insulating layers in-between, and a first end of the second linear conductor is connected to a first end of the first linear conductor by a first via conductor. A second end of the second linear conductor does not overlap the first linear conductor when viewed from the layer stacking direction.