Multilayer Coil Component Parallel Stacking for Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing coil electronic components face challenges in miniaturization and achieving high inductance while maintaining efficient electrical characteristics, as they are limited by their thickness and structural complexity.
Innovation Solution
A coil electronic component with a multilayer structure featuring parallel and series connections of coil patterns, conductive vias, and external electrodes, along with insulating layers and a magnetic core, which allows for reduced thickness and increased inductance through a collective stacking method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If coils are wound around a ferrite core in a conventional manner, then the inductor achieves sufficient inductance, but the thickness and overall size increase, limiting miniaturization
Solution Approach 1:
The patent transitions from conventional single-layer or simple multi-layer coil structures to a complex three-dimensional stacked configuration where multiple coil layers are arranged in different spatial dimensions and connected through conductive vias. This dimensional approach allows achieving high inductance within a reduced thickness by utilizing vertical stacking and inter-layer connections.
Solution Approach 2:
The patent implements nested coil structures where inner coils are positioned within the space of outer coils, and multiple coil layers are stacked with conductive vias connecting corresponding patterns across layers. This nesting approach maximizes the use of available space, allowing more turns and higher inductance within a compact footprint and reduced thickness.
2Reliability
If the number of coil turns is increased to achieve high inductance, then inductance improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the coil structure into multiple separate layers, each containing a portion of the total coil turns. Conductive vias connect corresponding patterns across layers to achieve the complete circuit. This segmentation allows each layer to be designed and manufactured independently with fewer turns, reducing the complexity of any single layer while achieving high total inductance through the stacked configuration.
Solution Approach 2:
The conductive vias serve multiple functions: they provide mechanical support between layers, enable electrical connection between corresponding coil patterns across layers, and facilitate the modular stacking architecture. This multi-functionality reduces the need for additional specialized components, simplifying the overall structure despite the multi-layer complexity.
3Ease of manufacture
If conventional winding methods are used, then manufacturing is straightforward, but the resulting component has larger size and lower inductance density
Solution Approach 1:
The patent employs preliminary patterning of coil designs on each layer before stacking, with conductive via locations pre-determined and prepared. This allows the complex multi-layer structure to be assembled through relatively simple stacking and connection processes, maintaining manufacturing ease while achieving high inductance density through the optimized three-dimensional configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables miniaturization and enhances inductance, reducing the thickness of the coil electronic component while maintaining high electrical performance, effectively addressing the limitations of existing technologies.
Implementation Method 1
conductive vias connecting the coil patterns formed on different levels to each other
Implementation Method 2
coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel
Data Source
AI summary
A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.