Multilayer Coil Circuit Element With Side-Electrode Capacitance
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Solution Overview
Problem
Existing high-frequency circuit elements face challenges in increasing density due to the need for larger insulating substrate layers and increased area requirements for capacitor electrodes, which limits their compactness and efficiency, especially at lower cut-off frequencies.
Innovation Solution
A circuit element design that incorporates a multilayer body with insulating substrates, coil conductors, and outer electrodes with varying widths, generating additional capacitance without increasing the number of substrate layers or area requirements, allowing for fine adjustments in capacitance and enhanced density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of insulating substrate layers is increased to achieve larger inductance or capacitance, then the required inductance or capacitance is met, but the height increases and density cannot be increased
Solution Approach 1:
The patent utilizes the side surface dimension of the multilayer body to place outer electrodes, generating capacitance in the lateral direction rather than requiring additional stacking layers. This dimensional shift allows capacitance to be achieved without increasing height, resolving the contradiction between capacitance requirements and compactness.
2Reliability
If the area for capacitor electrodes is increased to achieve larger capacitance, then the required capacitance is met, but the device area increases and density cannot be increased
Solution Approach 1:
The outer electrodes extend along the side surface of the multilayer body, utilizing the vertical and lateral dimensions rather than requiring large planar areas. This approach generates the necessary capacitance without increasing the device footprint, thereby increasing circuit density.
Solution Approach 2:
The outer electrodes serve dual functions: they provide electrical connection terminals and simultaneously generate capacitance through their proximity to internal electrodes. This multi-functionality eliminates the need for separate capacitor electrode areas, reducing overall device area while maintaining required capacitance.
3Ease of manufacture
If standard outer electrodes are used without width variation, then manufacturing is simple, but additional capacitance cannot be generated and density increases are limited
Solution Approach 1:
The outer electrodes incorporate portions with different widths along their length, creating local variations in capacitance generation. The wider portions generate more capacitance while narrower portions maintain simple manufacturing. This local quality variation allows additional capacitance to be generated without significantly complicating the overall fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of small-sized circuit elements with increased high-frequency density by generating additional capacitance between outer electrodes and coil or capacitor electrodes, improving frequency characteristics and reducing unwanted parasitic capacitances.
Implementation Method 1
An additional capacitance is generated between the second outer electrode and the first coil conductor due to the second outer electrode and the first coil conductor being adjacent to or within a vicinity of each other
Implementation Method 2
An additional capacitance is generated between the second outer electrode and the third capacitor electrode due to the second outer electrode and the third capacitor electrode being adjacent to or within a vicinity of each other
Implementation Method 3
An additional capacitance is generated between the seventh capacitor electrode and the ground electrode due to the ground electrode and the seventh capacitor electrode being adjacent to or within a vicinity of each other
Data Source
AI summary
A circuit element includes a multilayer body including insulating substrates, a first coil conductor inside the multilayer body, and first and second outer electrodes and a ground electrode on outer surfaces of the multilayer body. The first coil conductor includes a winding axis extending in a stacking direction of the insulating substrates, the first coil conductor is connected to the first outer electrode, the second outer electrode, or the ground electrode, and the second outer electrode extends along a side surface of the multilayer body. An additional capacitance is generated between the second outer electrode and the first coil conductor. The second outer electrode includes first and second portions with different widths in a layer direction of the insulating substrates and the width of the second portion is larger than the width of the first portion.