Multilayer Coil Design for Size Reduction and Short Circuit Prevention
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Solution Overview
Problem
Conventional high-frequency coils face challenges in downsizing while maintaining performance, as increasing inductance values often result in larger sizes and increased risk of short circuits due to the need for wider coil patterns and greater gaps between conductors, which complicates production and affects capacitance stability.
Innovation Solution
The design incorporates a multilayer body with alternating linear conductors of varying widths, where narrower conductors are strategically placed within the structure to overlap and maintain electrical connections, reducing the overall size without compromising capacitance stability, and using flexible dielectric layers to manage conductor spacing and prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the inductance value is increased by using wider coil patterns, then the inductance increases, but the component size increases and the risk of short circuits increases
Solution Approach 1:
The patent transitions from a single-layer coil pattern to a multi-layer stacked structure, utilizing the vertical dimension (stacking direction) to increase inductance. Multiple coil patterns are arranged in different layers and connected through via-holes, allowing the magnetic flux to pass through multiple layers and thereby increasing the inductance value without increasing the planar area of the component.
Solution Approach 2:
The patent employs a nested structure where multiple coil patterns are stacked within each other in the vertical direction. Each coil pattern in a lower layer is positioned to overlap with coil patterns in upper layers, creating a compact nested arrangement that maximizes the use of space and increases inductance within a small footprint.
2Reliability
If the gap between coil pattern portions is increased to prevent short circuits, then short circuit risk decreases, but the component size increases
Solution Approach 1:
The patent uses the vertical stacking dimension to separate coil pattern portions that would otherwise need large horizontal gaps. By arranging coil patterns in different layers and connecting them through via-holes, the design maintains adequate electrical isolation while minimizing the planar gap requirements, thus preventing short circuits without significantly increasing component size.
Solution Approach 2:
The patent employs asymmetric line widths for coil patterns in different layers, with narrower line widths in certain layers to reduce the required gap distance. This asymmetric design allows for compact spacing while maintaining reliability by optimizing the conductor dimensions according to their specific positional requirements in the stacked structure.
3Area of stationary object
If narrower coil patterns are used to reduce component size, then the component size decreases, but the floating capacitance becomes more sensitive to stacking errors
Solution Approach 1:
The patent applies different line widths to different coil patterns based on their local requirements. Wider line widths are used in layers where capacitance stability is critical, while narrower line widths are used in layers where space optimization is prioritized. This local differentiation allows the design to maintain capacitance stability in critical areas while achieving overall size reduction.
Solution Approach 2:
The patent divides the coil structure into multiple segments (coil patterns) across different layers, each with optimized dimensions. By segmenting the overall coil into multiple manageable parts with varying line widths, the design can optimize each segment's contribution to inductance while minimizing its impact on capacitance sensitivity to stacking errors.
4Power
If spiral coil patterns are used to increase inductance, then the inductance value increases, but the component size increases
Solution Approach 1:
The patent replaces traditional planar spiral coil patterns with a multi-layer stacked configuration. Instead of expanding the coil in the horizontal plane through spirals, the design stacks multiple linear or compact coil patterns vertically and connects them through via-holes. This dimensional transition allows achieving high inductance values within a compact planar footprint by utilizing the vertical stacking space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of electronic components while minimizing the risk of capacitance changes and short circuits, enhancing the passing characteristics and preventing common-mode noise in common-mode choke coils.
Implementation Method 1
a first coil pattern 18 and a second coil pattern 20... the first coil pattern 18 and the second coil pattern 20 are electrically connected through via-hole conductors v1-v4, thereby defining a coil L
Implementation Method 2
dielectric layers 16a-16e stacked in this order from the top to the bottom... floating capacitance between the coil patterns
Data Source
AI summary
An electronic component includes a multilayer body including insulating layers stacked in a stacking direction, first and second linear conductors having different line widths and provided on a respective one of the insulating layers, and third and fourth linear conductors having different line widths and provided on a respective one of the insulating layers. The insulating layer(s) supporting the third and fourth linear conductors is/are at one side in the stacking direction of the insulating layer(s) supporting the first and the second linear conductors. In a planar view from the stacking direction, the first and the fourth linear conductors overlap each other, and the second and the third linear conductors overlap each other. The first, the second, the third and the fourth linear conductors are electrically connected to define a coil.