Multilayer Coil Fabrication with Thin Inter-Conductor Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing multilayer coil components struggle to reduce the thickness of the insulator layer between conductive patterns, hindering miniaturization and performance improvements.
Innovation Solution
A method involving photolithography techniques to form insulator layers and conductors such that the first insulator layer aligns with the conductor's upper surface, allowing for precise adjustment of the second insulator layer's thickness and simultaneous formation of conductors and via conductors through photosensitive pastes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the insulator layer thickness is reduced to achieve miniaturization, then the component size is reduced, but the manufacturing precision becomes more difficult to control
Solution Approach 1:
The insulator layer formation process is divided into multiple sequential photolithography steps. First, a preliminary insulator layer is formed and planarized to be even with the conductor surface. Then, a second insulator layer is formed with precise thickness control to achieve the final thin insulator structure. This segmentation allows each layer to be controlled independently, enabling thinner overall insulation while maintaining manufacturing precision.
Solution Approach 2:
The first insulator layer is formed in advance and planarized to create a flat surface before forming the second insulator layer. This preliminary action ensures that the second layer can be deposited with uniform and precise thickness, solving the manufacturing precision challenge while enabling the overall miniaturization goal.
2Volume of moving object
If the insulator layer between conductive patterns is thinned, then the component is miniaturized, but the insulation performance may deteriorate
Solution Approach 1:
The patent employs a composite insulator structure consisting of two different insulator layers. The first insulator layer provides a planar base structure, while the second insulator layer provides the final thin insulation with optimized dielectric properties. This composite approach allows the overall component to be miniaturized while maintaining adequate insulation performance through the combined functionality of both layers.
Solution Approach 2:
The two insulator layers are designed with different local qualities and functions. The first layer provides mechanical support and planarization, while the second layer provides the final electrical insulation with optimized thickness. This local differentiation allows the thin second layer to provide sufficient insulation performance even though the overall insulator structure is thinned for miniaturization.
3Ease of manufacture
If the insulator layer and conductor are formed simultaneously, then the manufacturing process is simplified, but the insulator layer thickness cannot be reduced
Solution Approach 1:
The manufacturing process is segmented into distinct sequential steps: first forming the conductor layer, then forming and planarizing the first insulator layer, and finally forming the second insulator layer. This segmentation, while adding process steps, enables precise thickness control of each layer and allows the final insulator thickness to be reduced for miniaturization, overcoming the limitation of simultaneous formation.
Solution Approach 2:
The patent introduces a vertical dimensionality change by creating a two-layer insulator structure with different thicknesses. The first layer provides a thick planar base, while the second layer provides a thin final insulation layer. This dimensional approach allows the overall insulator thickness to be reduced while maintaining manufacturing control through sequential processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables thinner insulator layers between conductors, enhancing miniaturization and efficiency in the manufacturing process while allowing for easier adjustment of the magnetic path length.
Implementation Method 1
forming the plurality of insulator layers by a photolithography method using a photosensitive insulator paste
Implementation Method 2
forming the plurality of conductors and the via conductors by a photolithography method using a photosensitive conductive paste
Data Source
AI summary
A method for manufacturing a multilayer coil component 1 includes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.