Multilayer Coil Layout to Prevent Through-Hole Disconnection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing multilayer inductors face issues with through hole disconnection due to increased conductor volume at specific positions, which are prone to stress and disconnection during thermal expansion or contraction.
Innovation Solution
The multilayer coil component design includes first and second conductor patterns with parallel and non-parallel parts, connected via dispersed through holes, and incorporates pad portions and voids to distribute conductor volume, enhancing symmetry and inter-layer distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If through holes are concentrated at the same position to connect conductor patterns, then connection efficiency is improved, but conductor volume increases at that position causing stress concentration and through hole disconnection
Solution Approach 1:
The patent divides the through hole connections into multiple separate groups rather than concentrating them at one position. First through holes connect first pad portions at parallel parts, while second through holes connect second and third pad portions at non-parallel parts. This segmentation disperses the conductor volume distribution and avoids stress concentration, resolving the contradiction between connection efficiency and disconnection resistance.
2Reliability
If conductor volume is increased at specific positions to ensure connectivity, then connection reliability is improved, but stress concentration occurs leading to through hole disconnection during thermal expansion
Solution Approach 1:
The patent segments the conductor pattern connections into multiple spatially distributed groups. By connecting parallel parts through first through holes and non-parallel parts through second through holes, the conductor volume is distributed across different positions rather than concentrated, maintaining connection reliability while preventing stress concentration during thermal expansion.
Solution Approach 2:
The patent applies different connection configurations to different parts of the conductor pattern. Parallel parts use first through holes connecting first pad portions, while non-parallel parts use second through holes connecting second and third pad portions. This local differentiation optimizes each region's stress distribution and connection reliability.
3Volume of moving object
If layers are laminated closely to reduce component size, then miniaturization is achieved, but inter-layer distance decreases reducing withstand voltage
Solution Approach 1:
The patent creates voids at specific locations between the first and second insulator layers, particularly in regions where pad portions are positioned. This local modification of the layer structure increases the inter-layer distance and withstand voltage at critical positions without requiring overall miniaturization of the entire component, thus resolving the contradiction between size reduction and voltage resistance.
Data Source
AI summary
In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.