Multilayer Electronic Component Lamination With Convex Internal Electrodes
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Solution Overview
Problem
The increasing miniaturization and capacitance of multilayer electronic components lead to reduced thickness of dielectric layers and internal electrodes, causing step portions during lamination, which can result in deformation and short circuits between internal electrodes.
Innovation Solution
A method of manufacturing multilayer electronic components involves disposing internal electrode patterns with convex portions thicker than the main portions on dielectric green sheets, forming sheets with dielectric paste, and alternately stacking these sheets to form a laminated bar, which is then cut to form a laminate with external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of dielectric layers and internal electrodes is reduced to achieve miniaturization and higher capacitance, then the number of stacks increases and capacitance improves, but step portions are formed during lamination causing deformation and short circuits
Solution Approach 1:
The patent applies local quality by forming convex portions at specific locations on internal electrode patterns. These convex portions are thicker than the main body of the internal electrode, creating a localized thickness variation. This local thickening at the convex portions allows the electrode to bridge step portions during lamination without causing short circuits, while the rest of the electrode maintains its thin profile for miniaturization.
Solution Approach 2:
The patent implements preliminary action by pre-forming the convex portions on internal electrode patterns before the lamination process. This advance preparation ensures that when sheets are stacked and pressed, the convex portions are already in position to fill gaps and prevent short circuits, eliminating the need for additional corrective steps during lamination.
2Shape
If internal electrode patterns are formed with varying thickness to eliminate level differences, then step portions are reduced, but additional processes and separate ceramic sheets are required increasing complexity and cost
Solution Approach 1:
The patent merges the functions of level difference compensation and electrical connection into a single integrated structure. The convex portions of the internal electrodes serve dual purposes: they eliminate step portions during lamination and simultaneously maintain electrical connectivity. This integration eliminates the need for separate ceramic sheets or additional margin portions, simplifying the overall structure and process.
Solution Approach 2:
The convex portions perform multiple functions simultaneously: they act as spacers to eliminate level differences during lamination, maintain electrical connectivity between stacked sheets, and prevent short circuits. This multi-functionality replaces what would traditionally require multiple separate components or process steps, reducing overall system complexity.
Data Source
AI summary
A method of manufacturing a multilayer electronic component includes disposing first internal electrode patterns including a first main portion and a first convex portion, thicker than the first main portion, at a first gap, on a first dielectric green sheet, and forming a first sheet by applying a first dielectric paste to the first gap and the first internal electrode patterns, disposing second internal electrode patterns including a second main portion and a second convex portion, thicker than the second main portion, at a second gap, on a second dielectric green sheet, and forming a second sheet by applying a second dielectric paste to the second gap and the second internal electrode patterns, forming a laminated bar by alternately disposing the first sheet and the second sheet, forming a laminate by cutting the laminated bar, and forming an external electrode on the laminate.