Multilayer Electronic Component Structure for Crack-Safe Thinning

The patent applies local quality by creating different thickness variation characteristics in different layers: the internal electrode layers are designed with larger thickness variation while the dielectric layers maintain small thickness variation. This localized differentiation allows the component to be thinner while maintaining reliability, as the dielectric layers (which critical for electrical performance) remain uniform while the electrode layers accommodate the miniaturization requirements.

The patent applies parameter changes by inverting the conventional approach: instead of making both layers uniform, it sets the internal electrode layers with larger thickness variation and dielectric layers with smaller thickness variation. This parameter differentiation changes the stress distribution at the interface, preventing crack formation while maintaining reliability. The larger thickness variation in electrode layers accommodates thermal and mechanical stresses that would otherwise cause cracking.

The patent applies local quality by assigning different thickness variation characteristics to different layers based on their functional requirements. The internal electrode layers are designed with larger thickness variation to increase contacting area and suppress cracks, while the dielectric layers maintain precise thickness control for electrical performance. This localized quality differentiation resolves the contradiction between crack suppression and manufacturing precision by applying appropriate tolerance levels to each layer type.