Multi-Layer Component Electrochemical Isolation Zones
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Solution Overview
Problem
Existing methods for producing multilayer components, such as piezoelectric actuators, struggle to effectively create isolation zones and predetermined breaking areas to prevent uncontrolled crack formation and reduce the risk of short circuits, especially when adjacent electrode layers are exposed to mechanical stresses.
Innovation Solution
A method involving electrochemical etching is used to form insulation zones and predetermined breaking areas by applying voltage between auxiliary electrodes, allowing for controlled material removal and deposition, primarily using copper conductive layers, to create depressions that serve as isolation zones and weak points, thereby guiding crack propagation and enhancing component reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrochemical etching is used to create isolation zones and breaking areas, then reliability is improved by preventing uncontrolled crack formation and short circuits, but manufacturing precision is challenged by the need for controlled material removal and deposition
Solution Approach 1:
The patent replaces mechanical drilling or punching methods with electrochemical etching to create isolation zones and predetermined breaking areas. This substitution allows for precise material removal through controlled electrochemical reactions, eliminating mechanical stress and enabling complex geometries without tool interference, thereby simultaneously achieving high reliability and manufacturing precision
Solution Approach 2:
The patent utilizes parameter changes in the electrochemical etching process, including voltage, current density, electrolyte composition, and etching time, to precisely control the formation of isolation zones and breaking areas. By adjusting these parameters, the process achieves both high reliability through complete isolation and precise dimensional control for manufacturing requirements
2Reliability
If material is removed to form isolation zones and breaking areas, then reliability is improved by preventing short circuits, but the active component area is reduced
Solution Approach 1:
The patent applies local quality by creating isolation zones and breaking areas only at specific locations where electrical isolation and crack guidance are needed, rather than uniformly across the entire component. This localized approach ensures short circuit prevention at critical interfaces while preserving the maximum possible active component area for functional elements
Solution Approach 2:
The patent performs preliminary action by forming isolation zones and predetermined breaking areas during the manufacturing process before the component is put into service. This advance preparation ensures that crack propagation is guided along safe paths and electrical isolation is established before any failure can occur, maximizing both reliability and active area utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the risk of short circuits and improves the reliability of multilayer components by creating targeted isolation zones and breaking areas, minimizing active component area reduction and maintaining component functionality.
Implementation Method 1
A voltage is applied between the first and second auxiliary electrodes. In this way, material can be removed from at least one of the first and second electrically conductive layers. For example, the removal of material is electrically controlled, in particular generated by an electrochemical etching process.
Implementation Method 2
In this case, for example, material, in particular electrically conductive material such. B. a metal, detach from a first conductive layer and deposited on a second electrically conductive layer.
Data Source
Figure 1~3
Figure 4A~4E
Figure 5~7
AI summary
The invention relates to a method for producing a multi-layer component (21) in which a body (1, 81) is provided, comprising dielectric layers (3) arranged on top of each other, and first and second electrically conductive layers (4, 84, 5, 85) arranged therebetween. The first conductive layers (4, 84) are connected to a first auxiliary electrode (6) and the second conductive layers (5, 85) are connected to a second auxiliary electrode (7). The body (1, 81) is introduced into a medium and a voltage is produced between the first and second auxiliary electrodes (6, 7) to produce a removal of material. The invention further relates to a multi-layer component which has recesses (20) formed by an electrochemically controlled material removal.