Multilayer Electronic Component External Electrode Segmentation
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Solution Overview
Problem
Existing multilayer electronic components face challenges in reducing the thickness of external electrodes while maintaining mounting reliability, as conventional methods often result in increased risk of cracking and decreased adhesive strength due to copper damage during the mounting process.
Innovation Solution
The multilayer electronic component design incorporates a ceramic body with internal electrode layers and ceramic layers stacked alternately, featuring a base electrode layer of Cu, an intermediate electrode layer of Ni, and an upper electrode layer with elements having a higher standard electrode potential than Cu, such as Au or Pd, with specific thickness ratios and glass phases to enhance adhesion and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the external electrode is reduced to achieve a lower height component, then the mounting reliability deteriorates due to increased risk of cracking and copper damage
Solution Approach 1:
The external electrode is segmented into three distinct layers: a base electrode layer (Cu) for electrical connection, an intermediate electrode layer (Ni) for adhesion and corrosion resistance, and an upper electrode layer (Pd/Au) for oxidation resistance. This segmentation allows each layer to perform its specific function optimally, enabling reduced overall thickness while maintaining reliability.
Solution Approach 2:
The external electrode uses a composite structure combining multiple materials (Cu, Ni, Pd/Au) with different properties. The Cu provides conductivity, Ni provides adhesion and corrosion resistance, and Pd/Au provides oxidation resistance. This composite approach allows the electrode to be thinner while maintaining or improving mounting reliability compared to single-material electrodes.
2Reliability
If the intermediate electrode layer thickness is increased to improve adhesion and prevent cracking, then the external electrode thickness increases
Solution Approach 1:
The patent specifies optimal thickness ranges for each layer: the intermediate electrode layer should be 1-10 μm, and the upper electrode layer should be 0.1-2 μm. By controlling these parameters within specific ranges, the patent achieves sufficient adhesion and crack prevention without excessive thickness increase.
Solution Approach 2:
Different regions of the external electrode have different thickness requirements. The intermediate and upper electrode layers are designed with specific thicknesses at the maximum thickness part of the external electrode extension part, allowing adequate adhesion strength where needed while maintaining overall compact dimensions.
3Length of stationary object
If the base electrode layer is made thinner to reduce overall electrode thickness, then the copper damage risk increases during mounting
Solution Approach 1:
The intermediate electrode layer (Ni) acts as a mediator between the base electrode layer (Cu) and the upper electrode layer (Pd/Au). It provides a protective barrier that prevents direct exposure of Cu to the mounting environment, reducing copper damage risk even when the base electrode layer is made thinner.
Solution Approach 2:
The intermediate electrode layer serves as a sacrificial protective layer that can undergo controlled oxidation or damage before the base Cu layer is affected. This disposable intermediate layer protects the valuable Cu layer from direct harm during mounting processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the external electrode thickness, suppresses cracking, and improves mounting reliability by increasing the adhered area and preventing copper damage, while maintaining a compact size and enhancing heat impact resistance.
Implementation Method 1
the intermediate electrode layer includes Ni; the upper electrode layer includes an element having higher standard electrode potential than Cu
Implementation Method 2
the upper electrode layer includes an element having higher standard electrode potential than Cu
Data Source
AI summary
To improve a mounting reliability while maintaining a thickness of the external electrode at a side face of a multilayer electronic component thin. The multilayer electronic component includes ceramic body in which ceramic layers and an external electrode formed to an end face of the ceramic body. The upper electrode layer includes an element having higher standard electrode potential than Cu. The external electrode includes an external electrode end part and an external electrode extension part which is integrally formed with the external electrode end part. 1.20≤t2/t1≤4.50 is satisfied in which t1 is a total thickness of a thickness of the intermediate electrode layer thickness and t2 is a length from an end of the base electrode layer to an end of the upper electrode layer along the first axis of the external electrode extension part connected by the conductive adhesive.