Multilayer Electronic Component Interdiffusion Layer Control
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Solution Overview
Problem
Existing methods for manufacturing multilayer electronic components face issues with moisture penetration and insufficient electrical connection due to inadequate bonding of external electrodes with internal electrodes, leading to reduced capacitance and reliability under high-temperature, high-humidity conditions.
Innovation Solution
A method involving the formation of continuous plating layers on multilayer electronic components, followed by heat treatment to create interdiffusion layers between internal electrodes and plating layers, with specific distance control to ensure effective sealing and electrical connectivity, preventing moisture and contaminant penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste electrodes with large thickness are used to ensure good wettability to solder and electrical connection, then the reliability and electrical connection are improved, but the effective volume of the component is reduced, leading to lower capacitance
Solution Approach 1:
The external electrode is segmented into multiple functional layers: a thin plating layer (several micrometers) for electrical connection and solder wettability, and a paste electrode layer (several tens to hundreds of micrometers) for volume compensation. This segmentation allows each layer to optimize its specific function without compromising the other.
Solution Approach 2:
The external electrode uses a composite structure combining different materials with complementary properties: the plating layer provides electrical conductivity and solderability, while the paste electrode provides volume and mechanical support. This composite approach resolves the contradiction between thin-film performance and bulk volume requirements.
2Ease of manufacture
If electroless plating is used to form conductive metal layers on side surfaces to connect internal electrodes, then the manufacturing process is simplified, but moisture penetration occurs due to insufficient bonding between conductive metal layers and internal electrodes
Solution Approach 1:
The bonding strength is improved by changing the parameters of the electroless plating process, including adjusting the plating solution composition, temperature, and time to achieve optimal adhesion between the conductive metal layers and internal electrodes, preventing moisture penetration while maintaining manufacturing simplicity.
3Reliability
If heat treatment is performed to form interdiffusion layers between plating layers and internal electrodes to improve bonding, then the sealing and electrical connection are improved, but the manufacturing process complexity increases
Solution Approach 1:
The heat treatment step is merged with existing manufacturing processes, such as combining it with the sintering process or performing it as a brief intermediate step between plating and assembly. This integration reduces the overall process complexity while still achieving the desired interdiffusion layer formation for improved sealing and electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the sealing and electrical connection of multilayer electronic components, maintaining their properties under high-temperature, high-humidity conditions and ensuring continuity of plating layers, thereby improving the reliability and capacitance of the components.
Implementation Method 1
heat-treated at a temperature of about 600° C. or higher and an oxygen partial pressure of about 5 Pa or less, whereby interdiffusion layers are formed between the plating layers and internal electrodes. In the interdiffusion layers, the volume expansion of a metal included therein occurs.
Data Source
AI summary
In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm.