Multilayer Electronic Component Layout to Suppress Electrode Migration
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Solution Overview
Problem
Existing electronic components with conductive resin layers in their external electrodes are prone to migration due to electric fields, leading to metal deposition on the component's surface.
Innovation Solution
The electronic component design includes an element body with external electrodes featuring conductive resin layers on multiple sides, an electrical insulation film with film portions between the conductive resin layers, and internal electrodes positioned away from certain side surfaces to reduce leakage currents and prevent metal ion reaction with electrons.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is used in the external electrode, then electrical conductivity is improved, but metal particle migration occurs due to electric field acting on ionized metal particles
Solution Approach 1:
The patent applies different dielectric constants to different regions of the element body. Specifically, the second region adjacent to the first side surface has a smaller dielectric constant than the first region, creating local electrical property differences that suppress leakage current and prevent electron supply to metal ions in the conductive resin layer, thereby reducing migration while maintaining conductivity
2Reliability
If the conductive resin layer is positioned on multiple side surfaces, then electrical connection is improved, but migration occurs more frequently due to increased exposure to electric fields
Solution Approach 1:
The patent creates regions with different dielectric constants at different locations of the element body. The second region with smaller dielectric constant is specifically positioned adjacent to the first side surface where the conductive resin layer is located, providing localized protection against migration while allowing the conductive resin layer to extend across multiple surfaces for good electrical connection
3Object-generated harmful factors
If the dielectric constant is reduced in certain regions, then leakage current is suppressed and migration is prevented, but electrical insulation performance may be compromised
Solution Approach 1:
The patent reduces the dielectric constant only in the second region adjacent to the first side surface, while other regions maintain their original dielectric properties. This localized reduction suppresses leakage current and prevents migration in critical areas without compromising the overall electrical insulation performance of the component
Solution Approach 2:
The electrical insulation film with the film portion positioned on the second side surface acts as an intermediary structure. It provides additional insulation in regions where the dielectric constant is reduced, compensating for the reduced insulation capability and maintaining overall electrical performance while allowing the dielectric constant reduction to take effect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the occurrence of migration even when conductive resin layers are present on multiple sides of the external electrodes, by preventing electron supply to metal ions and thus inhibiting metal deposition on the component's surface.
Implementation Method 1
The second region includes the first side surface and has a dielectric constant smaller than a dielectric constant of the first region
Implementation Method 2
Electric field acts on the conductive resin layer, and the metal particle is ionized. Generated metal ion is attracted by electric field between the external electrodes and migrates from the conductive resin layer
Data Source
AI summary
An electronic component includes an element body, a plurality of external electrode each including a conductive resin layer, a plurality of internal electrodes each electrically connected to a corresponding external electrode of the plurality of external electrodes, and an electrical insulation film disposed on the element body. The element body includes a pair of end surfaces, and a first side surface and a second side surface adjacent to each other and to the pair of end surfaces. The element body includes a first region positioned away from the first side surface, and a second region including the first side surface and having a dielectric constant smaller than a dielectric constant of the first region. The plurality of internal electrodes are disposed in the first region. The electrical insulation film includes a film portion positioned on a region, of the second side surface, between the conductive resin layers.