Multilayer Electronic Component Mount Structure Preventing Short-Circuit
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Solution Overview
Problem
Conventional chip-type electronic component mount structures are prone to short-circuiting due to the movement of components during solder reflow, where the corner of one component can come into contact with adjacent components.
Innovation Solution
A multilayer electronic component mount structure featuring a multilayer body with dielectric and internal electrode layers, and insulating layers on the external electrodes, mounted on a substrate with a land electrode using a solder fillet, where the side surfaces of the component are perpendicular to the substrate, and the insulating layers cover the external electrodes to prevent contact between adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are self-supported by surface tension of solder cream, then the mounting process is simple, but component movement occurs during reflow leading to potential short-circuiting
Solution Approach 1:
The support protrusions and recesses serve as a mechanical intermediary that supplements the insufficient surface tension support. This added mechanical constraint maintains component stability during reflow without complicating the overall mounting process, as the support structures are integrated into the component and substrate designs.
2Reliability
If corner portions of external electrodes are exposed without insulation, then electrical connection is achieved, but adjacent components can come into contact causing short-circuiting
Solution Approach 1:
The support recesses are designed to position components such that the support protrusions physically separate adjacent components. This mechanical intermediary prevents corner portions of external electrodes from making contact, eliminating the short-circuit risk while maintaining proper electrical connections through the solder cream.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short-circuiting by ensuring that adjacent components do not come into contact during the mounting process, improving the reliability of the electronic component assembly.
Implementation Method 1
The electronic component is mounted on the land electrode with a solder fillet being interposed
Implementation Method 2
The insulating layer is provided on the first side surface of the multilayer body and the second side surface of the multilayer body
Data Source
AI summary
An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.