Multilayer Electronic Component Oxide Coating for Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in miniaturization and achieving high capacitance while maintaining moisture resistance reliability, as reducing the thickness of the cover and margin portions increases the risk of moisture permeation, leading to insulation breakdown and decreased reliability.
Innovation Solution
A multilayer electronic component design featuring a protective layer of wire-type oxides on the external surface or between the laminate and side margin portions, which enhances moisture resistance by providing hydrophobic properties and filling microscopic gaps, thereby improving the component's reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of the cover portion and margin portion is reduced to achieve miniaturization and high capacitance, then the proportion occupied by the capacitance formation portion is improved, but the moisture resistance reliability decreases due to increased exposure risk and moisture permeation through gaps
Solution Approach 1:
A protective layer is introduced as an intermediary element between the external environment and the multilayer electronic component. This protective layer fills gaps and provides a barrier that prevents moisture permeation, thereby protecting the component's reliability while allowing the cover and margin portions to be thin for high capacitance density.
Solution Approach 2:
The protective layer functions as a thin film structure that conformally covers the external surfaces of the component, including filling gaps between the side margin portion and the body. This thin film provides effective moisture protection without adding significant thickness to the overall component structure.
2Volume of moving object
If the cover portion and margin portion have excessively reduced thickness, then miniaturization is achieved, but the possibility of exposure of the capacitance formation portion increases
Solution Approach 1:
The protective layer is applied in advance to cover and protect the reduced-thickness cover portion and margin portion. This prior protective measure prevents potential exposure and damage to the capacitance formation portion, allowing the component to be miniaturized without compromising structural integrity.
3Strength
If a side margin portion is additionally attached, then structural support is improved, but moisture may permeate through minute gaps between the side margin and body, causing insulation breakdown
Solution Approach 1:
The protective layer is designed to fill and seal the minute gaps between the side margin portion and the body. By addressing these porous-like gaps with a conformal protective coating, moisture permeation is prevented while maintaining the structural support provided by the side margin portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer effectively increases the moisture resistance reliability of the multilayer electronic component by providing superhydrophobic properties and preventing moisture permeation, even when the component is subjected to external environments.
Implementation Method 1
A protective layer including a plurality of oxides having a wired form may be disposed on at least a portion of an external surface of the body
Implementation Method 2
A protective layer including a plurality of oxides having a wired form may be disposed on at least a portion of an external surface of the body
Data Source
AI summary
In a multilayer electronic component according to an aspect or another aspect of the present disclosure, a protective layer including a plurality of oxides having a wired form is disposed on at least a portion of an external surface of a body. Alternatively or optionally, the protective layer including an oxide having a wired form is disposed on at least a portion of a space between the body and a side margin portion. A surface of the multilayer electronic component has superhydrophobicity, thereby improving moisture resistance reliability of the multilayer electronic component.