Multilayer Component Non-Contacted Shielding Structure
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Solution Overview
Problem
Existing electrical multilayer components face challenges in achieving multiple electrical functions with minimal production technology adaptation and high integration density while maintaining a small size, along with high insertion loss and electromagnetic interference shielding.
Innovation Solution
An electrical multilayer component with a stack of dielectric and electrode layers, featuring an electrically uncontacted electromagnetic shielding structure surrounded by dielectric materials, which integrates resistance and filter structures to minimize electromagnetic interference and optimize size and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically contacted shielding structure is used, then electromagnetic shielding is achieved, but parasitic capacitances are introduced that degrade electrical functions
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the shielding electrode and adjacent electrode layers. This dielectric barrier prevents direct electrical contact while maintaining electromagnetic shielding effectiveness, thereby eliminating parasitic capacitances that would otherwise degrade filter and switching element performance
Solution Approach 2:
The electrical contact between the shielding structure and other electrodes is extracted/removed by electrically isolating the shielding electrode through dielectric layers. This allows the shielding function to be maintained while removing the harmful parasitic capacitance effect
2Productivity
If multiple electrical functions are integrated in a small component, then high integration density is achieved, but production technology complexity increases
Solution Approach 1:
Multiple electrical functions (filter, switching elements, shielding) are merged into a single multilayer component using a common base body with integrated electrode layers and dielectric structures. This consolidation achieves high integration density while using standardized production processes for creating the layered structure
Solution Approach 2:
The multilayer base body serves multiple functions simultaneously: it provides structural support, hosts electrode layers for filtering and switching, and accommodates dielectric layers for electrical isolation. This multi-functionality reduces the need for separate components and simplifies production
3Volume of moving object
If the component size is reduced, then miniaturization is achieved, but electromagnetic shielding effectiveness may be compromised
Solution Approach 1:
Electromagnetic shielding is achieved in the vertical dimension through stacked dielectric and electrode layers rather than requiring large lateral dimensions. The multilayer structure provides effective shielding within a compact volume by utilizing the stacking direction for both miniaturization and shielding functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields against electromagnetic interference, enhances integration density, and reduces insertion loss, enabling the component to perform multiple electrical functions efficiently with minimal size and production complexity.
Implementation Method 1
the electromagnetic shielding structure is surrounded entirely, i.e. on all sides, by dielectric materials. As a result, a particularly effective shielding function can develop, since the electromagnetic shielding structure is electrically uncontacted both from the outside and from the inside.
Implementation Method 2
a base body which has a stack with dielectric layers and electrode layers arranged alternately one above the other
Data Source
Figure 1a~1f
Figure 2a~3c
Figure 4
AI summary
The invention relates to an electric multi-layer component with a base body (1), comprising at least one stack of dielectric layers (2) and electrode layers (3) disposed alternately one above the other, and an electrically non-contacted protective structure (4).