Multilayer Electronic Component Si Diffusion Bonding
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with external electrode peeling after plating treatment and reduced mechanical strength due to inadequate bonding between the external electrode and insulating layer, limiting soldering area and fixing strength.
Innovation Solution
A multilayer electronic component design featuring a ceramic sintered body with an internal electrode layer and dielectric layer, where the external electrode includes glass containing Si, covers the insulating layer, and a diffusing layer with a Si concentration gradient at the bonding interface, enhancing mechanical strength and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the external electrode is extended to the side surface of the ceramic sintered body to improve fixing strength or flexural strength, then the mechanical strength is improved, but the insulating layer and the external electrode are hardly sufficiently bonded and the external electrode is peeled off after plating treatment
Solution Approach 1:
The patent changes the chemical composition parameters of the insulating layer by specifying that it contains glass with Si at 25 wt% or more. This compositional parameter change enables sufficient bonding between the insulating layer and external electrode while maintaining mechanical strength, resolving the contradiction between strength improvement and bonding reliability.
Solution Approach 2:
The patent uses a composite insulating layer composed of glass containing Si (25 wt% or more) combined with other components. This composite material structure provides both the mechanical strength needed for fixing and the chemical properties required for reliable bonding with the external electrode, simultaneously addressing both requirements.
2Ease of manufacture
If the external electrode and insulating layer are formed in different regions, then the manufacturing process is simplified, but the soldering area is insufficient and the fixing strength decreases
Solution Approach 1:
The patent merges the functions of the external electrode and insulating layer by having the external electrode extend onto the side surface where the insulating layer is formed. This merging of spatial regions allows the external electrode to serve both as an electrical connection element and as a mechanical anchoring element, increasing both soldering area and fixing strength while maintaining manufacturing simplicity.
3Area of stationary object
If the external electrode is extended to the side surface to increase soldering area, then the fixing strength is improved, but the external electrode peels off after plating treatment due to insufficient bonding
Solution Approach 1:
The patent addresses the bonding reliability issue by changing the compositional parameters of the insulating layer to contain glass with Si at 25 wt% or more. This parameter change ensures that as the external electrode extends to increase soldering area, the bonding between the insulating layer and external electrode remains sufficient to prevent peeling after plating treatment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses external electrode peeling and improves mechanical strength by ensuring strong bonding between the external electrode and insulating layer, maintaining structural integrity during soldering and mechanical stress.
Implementation Method 1
a diffusing layer is present at least at a bonding portion of the insulating layer with the external electrode in the side surface, and a gradient of a concentration of Si is present in the diffusing layer along a direction perpendicular to the bonding portion
Data Source
AI summary
A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.