Multilayer Electronic Component Side-Mounted Terminals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer electronic components face issues with low securing strength between the element body and the mounting terminal, leading to potential detachment during use.
Innovation Solution
The multilayer electronic component design includes a mount surface positioned parallel to the stacking direction of base layers, with mounting terminals embedded from this surface into the element body, enhancing securing strength and dimensional accuracy, and allowing for stable mounting on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mounting terminal is formed on the surface of the element body, then the manufacturing process is simple, but the securing strength between the element body and the mounting terminal is low
Solution Approach 1:
The patent transitions from surface-mounted terminals to terminals embedded in the side face of the element body. This dimensional change from surface mounting to side-face embedding increases the bonding area and structural integration, thereby improving securing strength while maintaining manufacturing feasibility through conventional ceramic processing techniques
Solution Approach 2:
The mounting terminal is nested within the element body structure, with the terminal embedded into the side face rather than attached externally. This nesting approach creates a more integrated structure where the terminal becomes part of the element body, enhancing mechanical strength and reliability
2Strength
If the mounting terminal is embedded from the mount surface into the element body, then the securing strength is improved, but the dimensional accuracy control becomes more difficult
Solution Approach 1:
The patent applies different processing approaches to different regions: the mount surface is formed with high precision perpendicular to the stacking direction, while the embedding depth and orientation of terminals on the side face are controlled through localized machining processes. This allows optimal dimensional control for each specific requirement
3Ease of manufacture
If the mount surface is positioned perpendicular to the stacking direction, then the mounting terminal can be easily formed, but the securing strength is reduced
Solution Approach 1:
The patent moves the mounting terminal formation from the top/bottom surfaces (perpendicular to stacking direction) to the side faces of the element body. This dimensional relocation allows the terminal to be embedded at an angle relative to the stacking direction, improving mechanical interlocking and securing strength while still using conventional forming methods
Data Source
AI summary
A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.