Multilayer Electronic Component With Thin External Electrode Layout
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face challenges in miniaturization and achieving high capacitance due to thick external electrodes formed by the dipping method, which hinders the securement of a high effective volume ratio and reliability, especially in automotive and infotainment systems.
Innovation Solution
A multilayer electronic component design featuring a body with dielectric layers and internal electrodes, where external electrodes are disposed on non-standard surfaces, utilizing conductive layers and insulating layers to ensure thin, uniform connections and improved sealing, allowing for increased capacitance per unit volume and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the external electrode is formed by the dipping method, then the external electrode can be easily manufactured, but the thickness of the external electrode in the central portion becomes too thick
Solution Approach 1:
The external electrode formation process is segmented into multiple steps: first forming a thin base layer through dipping, then selectively adding additional electrode material only to regions requiring thicker coverage. This segmentation allows the central portion to receive targeted material deposition while maintaining thin edges, resolving the thickness uniformity issue while preserving the ease of manufacture from the dipping method.
Solution Approach 2:
The external electrode is designed with non-uniform thickness distribution where the central portion has greater thickness and the edge portions have minimal thickness. This local quality variation optimizes the electrode structure by providing sufficient conductivity and capacitance in the central region while maintaining a thin profile at the edges to maximize effective volume ratio.
2Ease of manufacture
If the external electrode is formed by the dipping method, then the manufacturing process is simple, but external electrodes may be formed on surfaces except for the exposed surface of the internal electrode
Solution Approach 1:
Masking layers are applied to specific surfaces before the dipping process to prevent electrode material from depositing on unwanted areas. This preliminary action ensures that external electrodes are formed only on the intended exposed surfaces of the internal electrode, maintaining the simplicity of the dipping method while improving reliability by achieving the desired electrode placement and effective volume ratio.
Solution Approach 2:
The masking layer acts as an intermediary element during the dipping process, selectively blocking electrode material from reaching certain surfaces while allowing deposition on intended surfaces. This intermediary approach enables precise control over electrode formation without complicating the overall dipping manufacturing process.
3Productivity
If the number of stacks is increased to miniaturize and increase capacitance, then the capacitance per unit volume improves, but the external electrode thickness becomes more critical
Solution Approach 1:
The external electrode thickness parameters are optimized by changing the deposition conditions in different regions. The central portion uses parameters that produce thicker deposits for adequate capacitance, while edge portions use parameters that produce thinner deposits. This parameter change approach allows increased stacking density for higher capacitance per unit volume while maintaining precise thickness control through regional parameter optimization.
Data Source
AI summary
A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.