Multi-Layer Conductive Structure for Compact Biometric Patches
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Solution Overview
Problem
Existing electrode patch designs face challenges in achieving a compact size while maintaining efficiency and reliability for biometric parameter measurement, as increased compactness leads to reduced applicable voltages, increased ohmic resistance, and susceptibility to noise and defibrillation overload.
Innovation Solution
A multi-layer conductive layer structure with stacked conductive paths and intermediate layers, which reduces the footprint and increases the distance between paths, enhancing defibrillation resistance and measurement accuracy while allowing for higher voltages and currents, and incorporating elastic properties for improved handling and positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the layer structure is made more compact to reduce footprint, then the area occupied on the subject's surface is reduced, but the efficiency and reliability of signal measurement deteriorates
Solution Approach 1:
The patent transitions from a planar arrangement of conductive paths to a three-dimensional stacked configuration with multiple layers separated by intermediate layers. This vertical stacking allows multiple conductive paths to occupy the same footprint area while maintaining sufficient separation distances, thereby reducing the overall footprint without compromising measurement reliability.
Solution Approach 2:
The patent implements a nested structure where multiple conductive layers are stacked within a compact footprint, with each layer containing conductive paths that are spatially separated by intermediate layers. This nesting approach allows efficient use of space while maintaining the necessary distance between conductive elements for reliable signal measurement.
2Area of stationary object
If the layer structure is made more compact, then the footprint is reduced, but the ohmic resistance increases and applicable voltages decrease
Solution Approach 1:
By stacking conductive layers vertically, the patent increases the effective conductive cross-section without increasing the footprint. This three-dimensional configuration provides multiple parallel conduction paths, reducing overall ohmic resistance while maintaining a compact form factor.
3Area of stationary object
If the layer structure is made more compact, then the footprint is reduced, but the susceptibility to noise and defibrillation overload increases
Solution Approach 1:
The patent introduces intermediate layers between conductive paths in the stacked configuration. These intermediate layers act as mediators that provide electrical isolation and shielding, reducing coupling between adjacent conductive paths and protecting against noise and defibrillation overload while maintaining compact dimensions.
Data Source
AI summary
A conductive layer structure for application to a surface of a subject, in particular for use in medical products, includes a first conductive layer having at least one electrically conductive path. The conductive layer structure includes at least a further conductive layer having at least one electrically conductive path, and at least one intermediate layer extending at least partially between the first and further conductive layer. At least portions of the first and further conductive layer are arranged above one another within the layer structure. Further, the layer structure is elastically stretchable.