Multilayer Electronic Device Conductive Paste Contact Holes
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Solution Overview
Problem
In electronic devices with multilayer structures, the deposition of conductive material into contact holes is challenging due to the difficulty in coating upright internal surfaces and uneven insulation layers, leading to potential electrical contact failures.
Innovation Solution
A multilayer structure with a first recess on its surface and a conductive material in paste, liquid, or gel form is used, where the conductive material has a second recess with a bottom surface higher than the uppermost wire layer, ensuring secure electrical connections and preventing fractures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If material deposition such as sputtering is used to provide conductive material in contact holes, then electrical connection is achieved, but electrical contact failure occurs due to difficulty in depositing material on upright internal surfaces
Solution Approach 1:
The patent changes the physical state of the conductive material from solid (sputtering) to paste/liquid/gel form, enabling it to flow into and coat upright internal surfaces of contact holes effectively, thereby resolving the deposition difficulty while maintaining electrical connection reliability
Solution Approach 2:
The patent introduces a paste/liquid/gel conductive material as an intermediary substance that can bridge the gap between the contact hole structure and the electrical connection requirement, overcoming the limitations of direct solid material deposition
2Adaptability or versatility
If the insulation layer has wires extending thereover and thereunder creating uneven surface, then wire routing flexibility is improved, but material deposition becomes difficult causing break in the wire
Solution Approach 1:
The patent changes the conductive material to paste/liquid/gel form with appropriate viscosity and flow characteristics, enabling it to conform to uneven surfaces created by wire routing while maintaining precise material placement and preventing wire breaks
Solution Approach 2:
The paste/liquid/gel conductive material can locally adapt to different surface conditions in different areas, providing appropriate coverage and adhesion on uneven surfaces while maintaining consistent electrical properties throughout
3Productivity
If contact holes penetrate multiple layers in fewer steps, then manufacturing efficiency is improved, but the complexity of ensuring proper material deposition increases
Solution Approach 1:
The paste/liquid/gel conductive material serves multiple functions simultaneously: it fills the contact holes, coats the upright internal surfaces, provides electrical connection, and conforms to uneven surfaces, thereby simplifying the overall process despite penetrating multiple layers in fewer steps
Data Source
AI summary
An electronic device has a multilayer structure including a plurality of wires in multiple layers, and a conductive material on a surface of the multilayer structure for electrically connecting two or more wires included in the plurality of wires. The surface of the multilayer structure has a first recess. The conductive material is in the first recess and on the surface of the multilayer structure. The conductive material has an upper surface. The upper surface has a second recess corresponding to the first recess. The second recess has a bottom surface at a higher position than an upper surface of the uppermost layer of the two or more wires.