Multilayer Conductive Pattern Layout for Stable Electrical Connections
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining the reliability of conductive patterns due to their shape and structure, which affect driving efficiency.
Innovation Solution
The electronic device incorporates a substrate with a protruding pattern covered by a conductive pattern, an insulating layer with openings, and a second conductive pattern connected through these openings, allowing for a recessed design that stabilizes the conductive patterns on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive pattern is formed with a protruding structure to improve electrical connection, then the electrical conductivity is improved, but the reliability of the conductive pattern deteriorates due to increased stress concentration and manufacturing difficulty
Solution Approach 1:
The conductive pattern is divided into multiple segments: a first conductive pattern on the substrate, an insulating layer with openings, and a second conductive pattern filling the openings. This segmentation allows each layer to perform its specific function while reducing stress concentration on any single structure, thereby improving reliability without excessive complexity
Solution Approach 2:
The invention transitions from a two-dimensional planar conductive pattern to a three-dimensional multi-layer structure by adding vertical stacking with the insulating layer and openings. This dimensional change distributes the electrical connection function across multiple layers, reducing stress on individual structures and improving overall reliability
2Reliability
If the conductive pattern protrudes significantly to ensure electrical connection, then the electrical conductivity is improved, but the manufacturing precision deteriorates due to difficulty in forming and aligning protruding structures
Solution Approach 1:
The insulating layer with openings is formed beforehand on the substrate before depositing the second conductive pattern. This preliminary action defines the precise location and shape of future conductive structures, ensuring accurate alignment and formation without requiring complex subsequent processing steps
Solution Approach 2:
The insulating layer acts as an intermediary element between the substrate and the second conductive pattern. It provides a structured framework with pre-formed openings that guide the formation of the conductive pattern, thereby improving manufacturing precision while maintaining electrical connection reliability
3Productivity
If the conductive pattern is designed with complex shape to optimize driving efficiency, then the electrical performance is improved, but the reliability deteriorates due to stress concentration and potential disconnection
Solution Approach 1:
Different regions of the conductive system are assigned different qualities and functions: the first conductive pattern provides base electrical connection on the substrate, the insulating layer with openings provides structural support and electrical isolation, and the second conductive pattern provides additional conductivity in critical areas. This local differentiation optimizes driving efficiency while distributing stress across multiple simple structures rather than concentrating it in one complex pattern
Solution Approach 2:
The conductive system uses a composite structure combining conductive materials (first and second conductive patterns) with insulating materials (insulating layer). This composite approach allows each material to perform its optimal function - conducting electricity where needed while providing structural support and stress distribution, thereby improving reliability without sacrificing driving efficiency
Data Source
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Figure 2
AI summary
An electronic device includes a substrate, a protruding pattern, a first conductive pattern, an insulating layer, and a second conductive pattern. The protruding pattern is disposed on the substrate. The first conductive pattern is disposed on the substrate and covers the protruding pattern. The insulating layer is disposed on the first conductive pattern. The insulating layer includes an opening overlapping at least a portion of the protruding pattern. The second conductive pattern is disposed on the insulating layer. The second conductive pattern is connected to the first conductive pattern through the opening.