Low-Df Multilayer Conductor for Stronger Dielectric Adhesion
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Solution Overview
Problem
Existing inductive wireless power transfer methods face limitations in material selection for magnetic self-resonant structures due to requirements for electrical performance and dielectric strength, and struggle with adhesion between conductors and dielectric layers, which affects the efficiency and manufacturing cost of high-power applications.
Innovation Solution
A multilayer conductor structure is developed, comprising a conductor layer coated with a polymer composition having a low dissipation factor, including cyclic olefin copolymer, transoctenamer rubber, syndiotactic polystyrene, or their combinations, which improves adhesion with a dielectric layer, achieving a peel strength of at least 5 pounds of force per linear inch, and allows for flexible layer arrangements to achieve electrical resonance at target frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional dielectric materials are used in magnetic self-resonant structures, then material selection is limited due to electrical performance and dielectric strength requirements, but this restriction increases manufacturing complexity and cost
Solution Approach 1:
The patent changes the key parameter of dielectric material properties by specifying polymers with dissipation factor less than 0.001, thereby expanding material selection while maintaining electrical performance requirements for inductive wireless power transfer
Solution Approach 2:
The patent employs composite polymer dielectric materials combining multiple polymer components to achieve both low dissipation factor and adequate dielectric strength, thereby expanding material versatility while simplifying manufacturing through integrated material properties
2Reliability
If conventional bonding methods are used between conductor and dielectric layers, then adhesion is insufficient affecting power transfer efficiency, but improving adhesion through better materials increases manufacturing difficulty
Solution Approach 1:
The patent changes the chemical parameter of the dielectric material by selecting specific polymers with low dissipation factor that inherently provide improved adhesion to conductor layers, achieving peel strength of at least 5 PLI without adding complex manufacturing steps
Solution Approach 2:
The polymer dielectric layer acts as an intermediary between the conductor layer and the magnetic self-resonant structure, providing both electrical insulation and enhanced adhesion through its specific chemical composition and interface properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the bonding between conductor and dielectric layers, improving the efficiency and manufacturing ease of inductive wireless power transfer systems, enabling their use in high-power applications like electric vehicles and industrial equipment while reducing material limitations and manufacturing costs.
Implementation Method 1
the dielectric layer comprises a polymer composition having a dissipation factor (Df) of less than 0.001
Implementation Method 2
improving the adhesion between the metal of the conductor and the dielectric layer
Data Source
AI summary
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.