Multilayer Substrate Conductor Thickness for Impedance and Loss Control
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Solution Overview
Problem
Existing multilayer substrates face challenges in reducing transmission loss in conductive layers transmitting signals with different frequencies, as increasing thickness to decrease DC resistance leads to deviations in characteristic impedance and capacitance, making it difficult to minimize loss in both layers.
Innovation Solution
The multilayer substrate design includes a first conductive layer with a larger thickness than a second conductive layer, with the second layer overlapping the first in a direction perpendicular to the signal transmission, and a top conductive layer overlapping the second to maintain impedance and reduce capacitance, using a manufacturing process involving heating and pressurizing stacked insulating layers with thermoplastic resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the thickness of the second conductive layer is increased to reduce DC resistance, then transmission loss is reduced, but characteristic impedance deviates and capacitance increases
Solution Approach 1:
The patent applies different thicknesses to different conductive layers: the first conductive layer has a first thickness while the second conductive layer has a second thickness smaller than the first. This local differentiation allows each layer to be optimized for its specific function - the thicker first layer reduces DC resistance and transmission loss, while the thinner second layer maintains characteristic impedance and minimizes capacitance effects.
2Loss of energy
If the thickness of the second conductive layer is increased to reduce DC resistance, then transmission loss is reduced, but capacitance increases
Solution Approach 1:
The patent applies different thicknesses to different conductive layers: the first conductive layer has a first thickness while the second conductive layer has a second thickness smaller than the first. This local differentiation allows each layer to be optimized for its specific function - the thicker first layer reduces DC resistance and transmission loss, while the thinner second layer maintains characteristic impedance and minimizes capacitance effects.
3Adaptability or versatility
If different frequencies are transmitted through different conductive layers, then signal transmission is enabled, but transmission loss occurs in both layers
Solution Approach 1:
The patent changes the thickness parameter of the conductive layers to optimize performance. The first conductive layer has a first thickness and the second conductive layer has a second thickness smaller than the first. This parameter differentiation allows the system to transmit different frequency signals through different layers while minimizing transmission loss in each layer by optimizing their respective thicknesses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces transmission loss in both conductive layers by maintaining impedance and minimizing capacitance, allowing for efficient signal transmission with different frequencies.
Implementation Method 1
performing heating processing and pressurizing processing on a plurality of insulating layers including the third insulating layer after the plurality of insulating layers including the third insulating layer are stacked on each other in the up-down direction. A material for the plurality of insulating layers includes a thermoplastic resin.
Implementation Method 2
performing heating processing and pressurizing processing on a plurality of insulating layers including the third insulating layer
Implementation Method 3
performing heating processing and pressurizing processing on a plurality of insulating layers including the third insulating layer
Data Source
AI summary
A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.