Multilayer Structure Third Conductor Warp Suppression
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Solution Overview
Problem
The generation of unintended parasitic inductance and capacitance during the firing process of multilayer wiring boards, which leads to deformation and non-uniformity in the thickness direction of the substrate, causing warp and affecting the performance of ceramic multilayer wiring boards.
Innovation Solution
Incorporating a third conductor with a shape extending perpendicular to the main surface, positioned between the first and second conductors, which suppresses deformation and reduces the generation of parasitic components by minimizing shrinkage during firing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sheets are stacked and fired to produce a multilayer wiring board, then the multilayer structure is formed, but the sheets shrink during firing causing displacement of interconnection layers and generation of unintended parasitic inductance and capacitance
Solution Approach 1:
The patent applies local quality by making the third conductor have a different shape (extending in at least any direction as seen in a direction perpendicular to the main surface) compared to the first and second conductors (which extend parallel to the main surface). This localized structural differentiation allows the third conductor to specifically suppress deformation in the thickness direction without affecting the planar layout of other conductors, thereby reducing parasitic components while maintaining positioning accuracy.
Solution Approach 2:
The third conductor acts as an intermediary element positioned between the first and second conductors in the thickness direction. It mediates the shrinkage forces during firing by providing a structural reference that suppresses deformation of the first and second conductors, thereby preventing the generation of unintended parasitic inductance and capacitance without directly participating in the electrical interconnection.
2Manufacturing precision
If sheets are stacked and fired to produce a multilayer wiring board, then the multilayer structure is formed, but non-uniformity of firing shrinkage occurs in the thickness direction causing warp
Solution Approach 1:
The third conductor with its unique shape extending perpendicular to the main surface provides localized structural support in the thickness direction. This local structural enhancement compensates for non-uniform shrinkage forces during firing, maintaining the flatness and uniformity of the substrate without requiring uniform material properties throughout the entire structure.
Data Source
AI summary
A multilayer structure having a main surface includes: a first conductor extending in parallel with the main surface; a second conductor extending in parallel with the main surface and disposed at a different position from the first conductor with respect to a thickness direction of the multilayer structure; and a third conductor having a shape extending in at least any direction as seen in a direction perpendicular to the main surface. In a range higher than a lower end of the third conductor and lower than an upper end of the third conductor in the thickness direction of the multilayer structure, at least a part of the first conductor is included and at least a part of the second conductor is included.