Multilayer Electrical Connector Layout for Crosstalk-Shielded Signals
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Solution Overview
Problem
High-speed signal transmission in electronic devices often experiences impedance discontinuity and electromagnetic crosstalk due to varying terminal shapes and sizes, leading to resonance and potential damage to chips, which limits signal transmission rates and device performance.
Innovation Solution
An electronic assembly with a multilayer circuit board and electrical connector that includes signal terminals and ground terminals, where ground terminals are strategically placed between signal terminals to form a shielding cage, reducing crosstalk and enhancing interference shielding, thereby increasing signal transmission rates and device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If ground terminals are added between signal terminals to reduce crosstalk, then signal transmission rate is improved, but device complexity increases
Solution Approach 1:
The patent combines ground terminals with signal terminals to form integrated terminal groups, where ground terminals are strategically positioned between adjacent signal terminals. This merging approach creates a unified structure that provides shielding without requiring separate shielding components, thereby reducing overall device complexity while maintaining effective crosstalk reduction.
Solution Approach 2:
Ground terminals serve as intermediary elements between signal terminals, acting as electromagnetic shields that intercept and divert interfering signals. By placing ground terminals in the intermediate positions between signal terminals, the patent creates a natural shielding barrier that reduces crosstalk without complicating the overall connector architecture.
2Object-affected harmful factors
If more ground terminals are used to shield signal terminals, then interference shielding capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies ground terminals selectively at specific locations between signal terminals where crosstalk is most likely to occur. Rather than uniformly distributing ground terminals throughout the entire connector, the invention places them only in critical intermediate positions, optimizing interference shielding while minimizing manufacturing complexity and material usage.
Solution Approach 2:
The electrical connector is segmented into multiple terminal groups, each containing signal terminals and intermediate ground terminals. This segmentation allows for modular manufacturing processes where terminal groups can be fabricated and assembled systematically, reducing overall manufacturing complexity despite the presence of multiple ground terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields signal terminals from interference, improving signal transmission rates and reducing the risk of resonance, allowing for higher data speeds and stronger interference shielding, thus enhancing the performance and reliability of electronic devices.
Implementation Method 1
at least one ground terminal is disposed between any two adjacent groups of signal terminals... The ground terminal separates the signal terminals, and at least one ground terminal definitely exists on a side that is of any signal terminal and on which another signal terminal exists... to reduce crosstalk between terminals
Data Source
AI summary
An electronic assembly includes a first electronic component, a second electronic component, and an electrical connector connecting the first electronic component and the second electronic component. The electrical connector includes a first multilayer circuit board and a terminal that includes a plurality of signal terminals and a plurality of ground terminals. Each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component. Signal terminals configured to transmit a same signal form one group of signal terminals, and at least one ground terminal is disposed between two adjacent groups of signal terminals. The first multilayer circuit board includes at least one layer of first ground copper sheet. The first electronic component includes a second multilayer circuit board, and the second multilayer circuit board includes at least one layer of second ground copper sheet.