Sandwiched Multi-Layer Cooling Structure for Dense Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density computing systems face significant cooling challenges due to the close proximity of computing dies, which leads to increased heat generation in small volumes, and conventional cooling solutions are often too large to fit in the limited space between densely packed components.
Innovation Solution
A vertical cooling architecture is implemented, utilizing multiple levels of single- and double-sided cooling solutions between high-power electronic components, with cooling systems disposed on top of and beneath electronics layers, and power delivery occurring vertically to optimize space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional one-sided cooling solutions are used, then cooling capability is provided, but the footprint area becomes much larger than the electronic device, which is insufficient for high-density systems
Solution Approach 1:
The patent transitions from conventional horizontal/one-sided cooling to vertical double-sided cooling. Cooling systems are positioned on both the top and bottom surfaces of the electronics layer, utilizing the vertical dimension to dissipate heat from both faces of the high-power electronics, thereby reducing the required horizontal footprint area while maintaining or enhancing cooling capability
Solution Approach 2:
The cooling solution is segmented into multiple independent cooling systems positioned on different surfaces (top and bottom) of the electronics layer. Each cooling system independently manages heat from its respective surface, allowing for more efficient heat dissipation within a compact footprint by dividing the cooling function across multiple locations rather than requiring a single large cooling area
2Productivity
If computing dies are located very close together to increase computing density, then space efficiency and communication bandwidth improve, but heat generation in small volumes increases significantly
Solution Approach 1:
The patent addresses heat generation in high-density configurations by implementing vertical double-sided cooling that extracts heat from both the top and bottom surfaces of the electronics layer. This vertical heat extraction approach enables effective thermal management in compact volumes where horizontal heat dissipation space is limited, allowing computing dies to be placed closer together without excessive heat accumulation
Solution Approach 2:
The cooling systems are designed to extract heat directly from the surfaces of the electronics layer where high-power computing dies are located. By positioning cooling systems in direct thermal contact with the heat-generating components on both top and bottom surfaces, the patent efficiently removes heat from the source, enabling higher computing density without thermal runaway
3Temperature
If conventional cooling solutions with large footprint are used, then adequate cooling is provided, but they cannot fit in the limited space between densely packed computing dies
Solution Approach 1:
The patent resolves the space conflict by moving the cooling approach from horizontal expansion to vertical utilization. Double-sided cooling systems are positioned on the top and bottom surfaces of the electronics layer, extracting heat vertically from both faces of the thin electronics package. This enables adequate cooling effectiveness within the limited volume available in high-density computing systems, where horizontal space between components is insufficient for conventional large-footprint coolers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient cooling of high-density electronic systems within a compact structure, increasing computational density while effectively managing heat dissipation and mechanical integrity.
Implementation Method 1
a first surface of the first electronics layer is in thermal communication with the first cooling system; a second surface of the first electronics layer is in thermal communication with the second cooling system
Implementation Method 2
cooling systems disposed on top of and beneath electronics layers
Data Source
AI summary
The systems, methods, and devices disclosed herein relate to sandwiched multi-layer structures for cooling electronics. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer, the first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. In some embodiments, at least one layer can use system on wafer packaging.