Multi-Layer Organic Core Substrate for High-Speed Signal Transmission
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Solution Overview
Problem
Single-core organic package substrates suffer from conductor and dielectric losses, making them unsuitable for high-speed signal transmission, while ceramic substrates offer better loss characteristics but are costly and have reliability issues.
Innovation Solution
A multi-layer organic core package substrate is developed, featuring multiple organic core layers separated by core metal layers, which reduces conductor and dielectric losses, enabling high-speed signal transmission while maintaining power distribution and board-level reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-core organic package substrate is used, then manufacturing cost is reduced and ease of manufacture is improved, but conductor loss and dielectric loss increase making it unsuitable for high-speed signal transmission
Solution Approach 1:
The single organic core layer is segmented into multiple organic core layers separated by organic dielectric layers. This segmentation reduces the signal path length through any single organic material, thereby reducing conductor and dielectric losses while maintaining the manufacturing advantages of organic substrates.
Solution Approach 2:
The package substrate uses a composite structure combining multiple organic core layers with organic dielectric layers and metal build-up layers. This composite approach allows the substrate to achieve low loss characteristics suitable for high-speed signals while retaining the cost-effectiveness and manufacturability of organic materials.
2Loss of energy
If a ceramic package substrate is used, then conductor loss and dielectric loss are reduced for high-speed signal transmission, but manufacturing cost increases significantly
Solution Approach 1:
The invention uses organic materials that are cheaper and easier to manufacture than ceramic materials, while achieving comparable low-loss performance through the multi-layer configuration. The organic cores with controlled thickness and material properties provide the necessary signal integrity without the high cost of ceramic substrates.
3Ease of manufacture
If a single-core organic package substrate is used, then manufacturing cost is reduced, but signal transmission quality deteriorates at high speeds due to conductor and dielectric losses
Solution Approach 1:
By segmenting the organic core into multiple thinner layers separated by organic dielectric layers, the signal transmission path is divided into segments with lower individual losses. This maintains signal integrity for high-speed transmission while keeping the overall substrate cost-effective and manufacturable.
Solution Approach 2:
The invention changes the physical parameters of the substrate structure by introducing multiple organic core layers with specific thickness ranges (e.g., 5-20 micrometers each) and controlling the dielectric properties of the separating layers. These parameter changes reduce conductor and dielectric losses, improving signal transmission quality while maintaining manufacturing advantages.
Data Source
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AI summary
A multi-layer core organic package substrate (400) includes: a multi-layer core (409) comprising at least two organic core layers (41 1, 413), wherein two of the at least two organic core layers (41 1, 413) are separated by a core metal layer (401 ); a first plurality of build-up layers (207) formed on top of the multi-core layer (409); and a second plurality of build-up layers (207') formed below the multi-core layer (409).