Multilayer Conductive Layout for Creepage Discharge Suppression
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Solution Overview
Problem
In electronic apparatuses with conductive parts having different potentials, maintaining a sufficient creeping distance to prevent discharge is challenging, especially considering substrate shrinkage, and existing resin sealing methods increase material and manufacturing costs while risking insulation degradation.
Innovation Solution
The use of conductive protrusions on the first and second conductive parts, with protrusion lengths greater than or equal to 50 μm and up to 10% of the creeping distance, distributes electric field lines, suppressing discharge without the need for resin sealing, thereby reducing costs and preventing insulation deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a creeping distance is secured between conductive parts with different potentials to avoid discharge, then discharge prevention is improved, but the substrate area increases and manufacturing precision becomes more difficult due to substrate shrinkage
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Conductive parts are arranged in different layers (first conductive part in one layer, second conductive part in another layer), allowing discharge prevention through vertical separation rather than horizontal distance. This reduces the creeping distance requirement in the planar direction while maintaining effective discharge prevention through the layered structure.
Solution Approach 2:
The patent embeds conductive parts within a multi-layer substrate structure, where conductive parts are nested in different layers of the insulating substrate. The first conductive part is positioned in one layer and the second conductive part in another layer, creating a nested configuration that reduces the required creeping distance while maintaining discharge prevention through the insulating layers between them.
2Reliability
If resin sealing is used to suppress discharge regardless of creeping distance, then discharge prevention is improved, but material cost and manufacturing cost increase and insulation properties may deteriorate due to aging
Solution Approach 1:
The patent utilizes the insulating properties of the substrate layers themselves to prevent discharge, without requiring additional resin sealing materials. The multi-layer structure with insulating substrates between conductive parts provides inherent discharge prevention, eliminating the need for separate resin sealing processes and associated costs.
Solution Approach 2:
The patent removes the resin sealing component from the design by using the substrate's own insulating layers to provide discharge prevention. This extracts the unnecessary resin sealing step from the manufacturing process, reducing material costs and manufacturing complexity while avoiding the aging-related insulation deterioration that resin sealing can cause.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses discharge across various creeping distances without increasing material or manufacturing costs and mitigates insulation degradation, ensuring higher discharge start voltages and maintaining circuit integrity.
Implementation Method 1
The use of conductive protrusions on the first and second conductive parts, with protrusion lengths greater than or equal to 50 μm and up to 10% of the creeping distance, distributes electric field lines, suppressing discharge
Data Source
AI summary
The first conductive part includes a first surface layer part and a first inner layer part constituting a layer different from the first surface layer part in the substrate. The second conductive part includes a second surface layer part facing the first surface layer part with a creeping distance therebetween, and a second inner layer part constituting a layer different from the second surface layer part in the substrate. The electronic apparatus is provided with at least one of a first protruded configuration and a second protruded configuration. The first protruded configuration is configured such that the first inner layer part includes a first conductive protrusion protruding towards the second conductive part from the first surface layer part. The second protruded configuration is configured such that the second inner layer part includes a second conductive protrusion protruding towards the first conductive part from the second surface layer part.