Multi-layer Data Center Cooling Airflow Distribution
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Solution Overview
Problem
Existing airflow management solutions in data centers are inefficient in distributing and managing cooling air to clusters of IT equipment, especially when using hybrid cooling systems, leading to suboptimal cooling performance and increased energy consumption.
Innovation Solution
A multi-layer airflow distribution system that separates and efficiently manages airflow to both air-cooled and liquid-cooled heat loads, utilizing a dedicated cooling air plenum to distribute cool air from a source to both ceiling and IT regions, with adjustable intake modes and modular design for versatility and flexibility in data center configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing airflow management solutions are used, then the system is simple to implement, but airflow distribution efficiency to IT equipment clusters deteriorates
Solution Approach 1:
The cooling infrastructure is segmented into multiple layers: a ceiling layer containing liquid-to-air heat exchangers and a plenum layer below the raised floor. This segmentation allows independent optimization of each layer's airflow characteristics, improving overall distribution efficiency while maintaining manageable complexity through modular design
Solution Approach 2:
The patent introduces a vertical dimension to airflow management by creating separate ceiling and plenum layers. Cool air is supplied from the ceiling layer down through the plenum layer to IT equipment clusters, utilizing vertical airflow paths rather than traditional horizontal distribution, thereby improving efficiency without proportionally increasing complexity
2Reliability
If hybrid cooling is implemented, then cooling performance for high-power components improves, but airflow management accuracy deteriorates
Solution Approach 1:
Different regions of the data center are provided with different airflow characteristics: the ceiling layer supplies cool air for general cooling while the plenum layer provides conditioned air specifically to IT equipment clusters. Each region's airflow properties are optimized for its specific cooling requirements, improving overall cooling reliability while maintaining accurate airflow management through localized control
Solution Approach 2:
The plenum layer acts as an intermediary between the ceiling layer heat exchangers and the IT equipment. It receives conditioned air from above, conditions it further, and distributes it precisely to equipment clusters, thereby maintaining both high cooling performance and accurate airflow management in hybrid cooling scenarios
3Ease of operation
If air cooling is used for all equipment, then the system is simple to operate, but cooling effectiveness for high-power components deteriorates
Solution Approach 1:
The cooling infrastructure is designed to serve multiple cooling needs through a unified system. The ceiling layer and plenum layer work together to provide both general ambient cooling and targeted cooling for high-power components, eliminating the need for separate cooling systems and maintaining operational simplicity while improving cooling effectiveness across all equipment types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances airflow management efficiency, improving data center energy efficiency and versatility, allowing for effective cooling of both air-cooled and liquid-cooled components, and is compatible with various data center designs, including hyperscale and container designs.
Implementation Method 1
heat from the heat-generating components is transferred through fluid connections in the loop to a working liquid
Implementation Method 2
heat from the working liquid is transferred to air, usually atmospheric air
Implementation Method 3
cool air from the cooling plenum is supplied to the IT layer to cool the IT equipment
Data Source
AI summary
Embodiments are disclosed of a cooling system for use in a data center. The cooling system includes an IT region, a ceiling region, and a cooling air plenum sandwiched between the IT region and the ceiling region. The IT region includes one or more IT plenums that are coupled to the cooling air plenum to supply cooling air to the IT region, which can have house a plurality of IT racks that are clustered around the IT plenums and are adapted to house one or more pieces of liquid-cooled or hybrid-cooled information technology (IT) equipment. The ceiling region includes one or more ceiling plenums and one or more sets of heat exchangers, each heat exchanger being cooled by the cooling air delivered to the ceiling plenums. The cooling air plenum is fluidly coupled by a flow control to the one or more IT plenums and is fluidly coupled by a flow control to the one or more ceiling plenums or to the volume of the ceiling region between ceiling plenums.