Multi-layered Electronic Device with Through-Hole Interconnects
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Solution Overview
Problem
Existing wearable and implantable electronic devices face challenges in efficiently connecting multiple components and maintaining robust electrical connections, especially in compact configurations, while also requiring flexibility and resistance to mechanical stresses.
Innovation Solution
The development of multi-layered electronic devices comprising stacked metal conducting layers with dielectric and insulating layers, along with electrical connections through holes, allows for efficient connection and flexible configurations, using materials like gold, platinum, or carbon nanotube ink, and is scalable to withstand mechanical forces and maintain impedance for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple metal conducting layers are stacked to improve connection efficiency, then the device complexity increases, but the manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The device is divided into multiple discrete conducting layers separated by dielectric layers, with each layer being independently formed. This segmentation allows for standardized layer thicknesses (e.g., 10-50 μm for conducting layers, 5-20 μm for dielectric layers) and systematic formation processes, improving manufacturing precision while maintaining connection efficiency through the multi-layer architecture.
Solution Approach 2:
Multiple conducting layers are nested within dielectric layers in a stacked configuration, with each layer contained within its own dielectric enclosure. This nesting approach provides precise spatial definition for each layer, ensuring consistent spacing and alignment through controlled dielectric layer thickness, thereby maintaining manufacturing precision as the device scales to multiple layers.
2Area of stationary object
If the device is made compact to improve wearability, then the area is reduced, but the electrical connection robustness deteriorates
Solution Approach 1:
The device transitions from a two-dimensional planar layout to a three-dimensional stacked architecture, stacking multiple conducting layers vertically within the dielectric matrix. This dimensional change allows the device to maintain a compact footprint while achieving robust electrical connections through multiple vertically-stacked conductive paths, effectively decoupling device area from connection robustness.
3Adaptability or versatility
If flexible materials are used to improve adaptability, then the mechanical strength decreases, but the device can withstand mechanical stresses better
Solution Approach 1:
The device employs a composite structure combining flexible conducting layers (e.g., thin metal films or conductive polymers) with mechanically robust dielectric layers. This composite architecture provides flexibility through the thin conducting layers while the dielectric layers contribute mechanical strength and structural integrity, allowing the device to withstand bending and stretching stresses that would otherwise compromise flexible materials alone.
4Reliability
If through holes are created in dielectric layers to establish electrical connections, then the manufacturing complexity increases, but the electrical conductivity improves
Solution Approach 1:
Through holes are formed in the dielectric layers during the manufacturing process before final assembly, allowing conductive elements to be pre-positioned and connected between layers. This preliminary formation of connection pathways simplifies subsequent assembly steps and ensures precise alignment of electrical connections, reducing overall manufacturing complexity while achieving reliable inter-layer conductivity.
Data Source
AI summary
A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.