Display Device Multilayer Wiring for Thin-Bezel Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in achieving thin bezels due to wiring limitations around non-display areas or substrate openings, which are not suitable for thin bezel designs.
Innovation Solution
A display device structure comprising multiple conductive layers and insulating layers, where a third conductive layer in the non-display area electrically connects to the first conductive layer via holes in insulating layers, allowing signal transmission without causing short circuits, thus enabling thin bezels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional wiring layout is used around non-display area, then wiring can be simply arranged, but bezel thickness increases and thin bezel design cannot be achieved
Solution Approach 1:
The patent transitions from planar wiring layout to three-dimensional wiring architecture by stacking multiple conductive layers (first, second, and third conductive layers) at different heights. This vertical dimensionality change allows signal lines to pass through the non-display area without increasing bezel thickness, as wires no longer need to route horizontally around the non-display region but can instead traverse vertically through insulating layers and connect via conductive vias.
Solution Approach 2:
The wiring system is segmented into multiple independent conductive layers separated by insulating layers. Each conductive layer can be independently routed and connected, allowing complex signal paths to be divided into manageable segments that pass through different vertical levels. This segmentation enables thin bezel design by distributing wiring across multiple layers rather than confining all wiring to a single plane at the bezel edge.
2Length of moving object
If multiple conductive layers are stacked to enable thin bezel, then thin bezel design is achieved, but risk of short circuit between layers increases
Solution Approach 1:
Insulating layers are introduced as intermediary materials between adjacent conductive layers. These insulating layers completely isolate the first, second, and third conductive layers from each other, preventing any direct electrical contact that could cause short circuits. The insulating layers act as mediators that maintain electrical separation while still allowing mechanical support and signal transmission through the stacked structure.
Solution Approach 2:
Different regions of the stacked structure have different electrical properties: conductive layers provide electrical connectivity where needed, while insulating layers provide electrical isolation between layers. This local differentiation of electrical quality allows the structure to simultaneously enable signal transmission through conductive paths while preventing short circuits through insulating barriers at critical interfaces.
3Speed
If wiring distance is reduced for thin bezel, then signal transmission efficiency improves, but wiring layout becomes more constrained
Solution Approach 1:
The wiring layout gains flexibility by utilizing the vertical dimension through stacked conductive layers. Signal lines can travel shorter horizontal distances by transitioning to upper or lower conductive layers, reducing overall wiring length and improving signal transmission efficiency. The multi-layer architecture provides additional routing paths that increase layout flexibility rather than constraining it, as wires can switch layers to navigate around obstacles like non-display areas.
Solution Approach 2:
Each conductive layer serves multiple functions: it provides signal transmission pathways, acts as a routing plane for different signal types, and enables vertical connectivity through conductive vias. This multi-functionality of each layer increases overall wiring versatility, allowing the same stacked structure to accommodate various signal routing requirements while maintaining short wiring distances for improved transmission efficiency.
Data Source
AI summary
A display device includes: a substrate having a display area and a non-display area adjacent to the display area; a first conductive layer disposed on the substrate and including first conductive line; a first insulating layer disposed on the first conductive layer; a second conductive layer disposed on the first insulating layer and including a second conductive line, wherein, corresponding to the display area, the second conductive line and the first conductive line cross from a top view; a second insulating layer disposed on the second conductive layer; and a third conductive layer disposed on the second insulating layer and including a third conductive line; wherein, corresponding to the non-display area, a portion of a projection of the third conductive line on the substrate is overlapped with a portion of a projection of the first conductive layer on the substrate.