Multilayer ECU Board Layout for Heat Dissipation to Metal Housing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing size reduction and higher capabilities of electronic control devices lead to concerns about heat dissipation due to the rise in temperature on the board, necessitating improved heat dissipation capabilities.
Innovation Solution
A multilayer board with conductor layers stacked with insulating layers, featuring earth and ground layers facing each other in the thickness direction, and thermal vias connecting these layers, facilitating efficient heat transfer to a metal housing for external dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If mounting density of electronic components on boards is increased to reduce device size, then device size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes the thickness direction (Z-axis) of the board by stacking multiple conductor layers with insulating layers in between. This three-dimensional layered structure allows heat to be dissipated through the thickness direction in addition to the planar direction, effectively utilizing the Z-axis dimension for heat management while maintaining high component density on the board surface.
Solution Approach 2:
The board is divided into multiple conductor layers separated by insulating layers, with thermal vias penetrating through specific insulating layers. This segmentation creates multiple thermal conduction paths through different layers, allowing heat to be dissipated through multiple parallel routes rather than a single path, thereby improving overall heat dissipation capability.
2Temperature
If thermal vias are added to improve heat dissipation, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
Instead of providing thermal vias through all insulating layers, the patent selectively provides thermal vias only through the first insulating layer that is positioned adjacent to the heat-generating component. This partial action approach achieves effective heat dissipation from the critical heat-generating area without the excessive complexity of modifying all insulating layers, thereby balancing heat dissipation performance with manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhanced heat dissipation capabilities through increased surface area and reduced thermal resistance, allowing for effective heat transfer and dissipation from heat-generating components.
Implementation Method 1
Heat that is generated from the heat-generating components is transferred from the front face to the rear face of the board through the thermal vias
Implementation Method 2
The heat transferred to the rear face of the board is externally dissipated via the frame
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An electronic control device (10) includes a board (21) that is configured to be attached to a housing (11) that is made of metal by a fixing member (22) that is made of metal, the board (21) having a plurality of conductor layers (L1 to L6) stacked with an insulating layer (L7) interposed between, and a heat generating element (23) that is configured to generate heat when electric current is applied. The plurality of conductor layers (L1 to L6) includes a first particular conductor layer (L1, L3, L5) that includes an earth layer (E1 to E3) that is configured to be electrically connected to the housing (11), and a second particular conductor layer (L2, L4) that includes a ground layer (G1, G3) that is configured to be electrically connected to the heat generating element (23). The earth layer (E1 to E3) and the ground layer (G1, G3) at least partially face each other in a thickness direction of the board (21) with an insulating layer (L7) interposed between.