Multilayer Electric Element with 3D Transmission Line for Compact Circuit Boards
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Solution Overview
Problem
The challenge in electronic devices is the limited mounting space for cable-shaped transmission lines on circuit boards, leading to footprint issues and electromagnetic interference (EMI) when trying to surface-mount them alongside other components, especially in small devices.
Innovation Solution
The solution involves a multilayer body with projecting and recessed portions on the electric element, allowing it to straddle other components and use space efficiently, with a configuration of signal lines and ground conductor patterns that reduce EMI by interposing conductors between the signal lines and other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the transmission line is formed in a thin sheet shape to reduce thickness, then the transmission line can be disposed in a narrow gap inside the casing, but the footprint of the transmission line becomes a problem and it cannot be mounted around the locations at which other electronic components are disposed
Solution Approach 1:
The transmission line is formed with a non-planar three-dimensional shape including projecting portions and recessed portions, allowing it to utilize the thickness dimension effectively. This enables the transmission line to be mounted in limited space by extending in the thickness direction rather than only in the planar area, thereby reducing footprint while maintaining necessary transmission line length and functionality.
Solution Approach 2:
The transmission line is divided into multiple sections with different height positions (projecting portions and recessed portions) relative to the circuit board. This segmentation allows different parts of the transmission line to be positioned at different heights, enabling flexible routing around other components and reducing the overall footprint on the circuit board surface.
2Area of stationary object
If the width of the transmission line is narrowed to reduce the footprint, then the area of ground conductor patterns that sandwich the signal line reduces, but an electromagnetic interference (EMI) problem easily occurs between the transmission line and another electronic component
Solution Approach 1:
Instead of reducing ground conductor area by narrowing the transmission line width in the planar direction, the invention extends the transmission line and ground conductors in the thickness direction. This creates vertical separation and three-dimensional grounding paths that maintain effective ground area and EMI shielding performance while reducing the planar footprint.
Solution Approach 2:
The transmission line structure incorporates local variations in height with projecting portions and recessed portions at specific locations. This allows the ground conductor patterns to be positioned at different heights relative to signal lines, creating localized shielding zones that prevent EMI with adjacent components while maintaining compact overall dimensions.
3Adaptability or versatility
If the transmission line is mounted together with many electronic components in a limited space, then the degree of freedom of mounting is reduced, but the transmission line cannot be mounted around the locations at which other electronic components are disposed
Solution Approach 1:
The transmission line utilizes the thickness dimension by incorporating projecting portions that extend upward and recessed portions that lie closer to the circuit board. This three-dimensional configuration allows the transmission line to route around vertically positioned electronic components, providing high mounting flexibility in limited planar space.
Solution Approach 2:
The transmission line is formed with a flexible non-planar shape that can adapt its configuration to accommodate different component layouts. The projecting and recessed portions can be positioned at different locations and heights to suit various mounting scenarios, providing dynamic adaptability to different electronic device designs.
Data Source
AI summary
An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.