Multilayer Electronic Component Electrode Bonding Against Peeling
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Solution Overview
Problem
Existing multilayer ceramic capacitors face issues with the peeling off of external electrodes due to insufficient securing forces, which can compromise the reliability and durability of the electrical connection with circuit boards.
Innovation Solution
The integration of a diffusion layer formed by sharing materials between the underlying and external electrodes, secured through a process involving metal diffusion at elevated temperatures, enhances the bonding strength between these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is deposited on the underlying electrode by plating to form the external electrode, then the electrical connection is established, but the securing force is insufficient causing electrode peeling
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of the underlying electrode, diffusion layer, and external electrode. The diffusion layer acts as an intermediate composite material that metallurgically bonds the underlying electrode and external electrode, combining the advantages of both materials while eliminating the weakness of insufficient adhesion in simple plating structures.
Solution Approach 2:
The diffusion layer serves as an intermediary between the underlying electrode and the external electrode. This intermediate layer facilitates metallurgical bonding and material diffusion, creating a strong mechanical and chemical connection that transfers stress and prevents peeling, thereby resolving the contradiction between electrical connectivity and mechanical strength.
2Ease of manufacture
If the external electrode is directly plated on the underlying electrode, then the manufacturing process is simple, but the adhesion is insufficient leading to peeling
Solution Approach 1:
The patent applies preliminary action by forming the diffusion layer before completing the external electrode structure. This preliminary diffusion layer creation enables subsequent metallurgical bonding and prevents peeling issues that would arise with direct plating, while still maintaining a relatively streamlined manufacturing process through integrated firing steps.
3Strength
If a diffusion layer is formed between underlying and external electrodes, then the securing force is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the diffusion layer formation process with the existing sintering/firing process of the multilayer ceramic capacitor. By combining these steps, the manufacturing complexity is minimized while still achieving the desired metallurgical bonding and diffusion effects, resolving the contradiction between enhanced strength and process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the probability of external electrode peeling, thereby improving the reliability and durability of the electrical connection with circuit boards.
Implementation Method 1
The underlying electrode and the external electrode are secured by sharing a diffusion layer in which a material of the underlying electrode and a material of the external electrode coexist with each other
Data Source
AI summary
In a multilayer electronic component, an effective portion includes dielectric layers and internal electrodes alternately laminated in a laminating direction. A cover is superposed on the effective portion from a first side in the laminating direction. An underlying electrode is superposed on the cover from the first side. An external electrode is superposed on the underlying electrode from the first side. The underlying electrode and the external electrode are secured by sharing a diffusion layer in which a material of the underlying electrode and a material of the external electrode coexist with each other.