Multilayer Electrode Structure for Thermal Expansion Buffering
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Solution Overview
Problem
Existing antenna devices face issues due to the difference in thermal expansion coefficients between metal electrodes and passivation layers, leading to microcracks and potential corrosion.
Innovation Solution
The electronic device incorporates a multilayer electrode structure with a third conductive layer acting as a buffer, entirely covering the second conductive layer to mitigate thermal expansion coefficient differences and improve adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal electrode and passivation layer structure is used, then good electrical conductivity is achieved, but microcracks form due to thermal expansion coefficient difference
Solution Approach 1:
The electrode structure is segmented into multiple conductive layers with different materials. The first conductive layer (metal) provides electrical conductivity, while the second conductive layer (different material) provides thermal expansion buffering, dividing the functional requirements across separate layers to resolve the contradiction between conductivity and structural stability
Solution Approach 2:
The patent uses composite material structure with at least two different conductive materials stacked together. This composite approach allows combining materials with different properties - one optimized for electrical conductivity and another optimized for thermal expansion matching with the passivation layer, thereby achieving both good electrical performance and structural stability
2Reliability
If a single-layer conductive structure is used, then manufacturing simplicity is maintained, but adhesion and thermal expansion compatibility are insufficient
Solution Approach 1:
The single-layer structure is segmented into multiple layers, where each layer has a specific function. The first layer provides conductivity and the second layer provides adhesion and thermal expansion buffering, achieving better overall performance despite increased structural complexity
Solution Approach 2:
The second conductive layer acts as an intermediary between the first conductive layer and the passivation layer. It mediates the thermal expansion difference and improves adhesion, serving as a buffer zone that resolves the incompatibility between the metal electrode and the passivation layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the risk of microcracks in the passivation layer and corrosion of the multilayer electrode, enhancing the operational reliability and stability of electronic devices.
Implementation Method 1
a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer
Data Source
AI summary
An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.