Multilayer Electrode Structure for Sintering-Stable Capacitance
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) experience issues with internal electrode shrinkage and cracking during sintering, leading to broken connections between internal and external electrodes, which reduces capacitance.
Innovation Solution
A multilayer electronic component design featuring internal electrodes alternately disposed with dielectric layers, connected by connection electrodes that penetrate the dielectric layer and include via electrodes laminated in a specific direction, with adjacent via electrodes shifted perpendicular to the lamination direction to enhance mechanical strength and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal electrodes are shrunk during sintering to reduce component size, then miniaturization is achieved, but connection between internal electrodes and external electrodes breaks
Solution Approach 1:
The internal electrode is divided into multiple segments along the thickness direction, with each segment having a different thickness. This segmentation allows the electrode to accommodate shrinkage during sintering while maintaining electrical connection, as the segmented structure can flexibly adjust to dimensional changes without breaking the overall connectivity.
Solution Approach 2:
The internal electrode is designed with pre-calculated non-uniform thickness distribution before sintering, anticipating the shrinkage that will occur during the sintering process. The thicker portions are strategically placed to ensure that even after shrinkage, adequate connection area remains between the internal electrode and external electrodes.
2Volume of moving object
If internal electrode thickness is reduced to achieve smaller component size, then miniaturization is achieved, but cracks occur in the body
Solution Approach 1:
The internal electrode is designed with non-uniform thickness, having different thicknesses in different regions. The thickness is greater in areas where mechanical support is needed and thinner in areas where miniaturization is prioritized. This local variation in quality allows the component to achieve small overall size while maintaining sufficient mechanical strength in critical regions.
Solution Approach 2:
The electrode thickness distribution is pre-optimized before sintering to anticipate and compensate for potential cracking during the sintering process. Thicker sections are positioned at locations prone to stress concentration, providing preliminary reinforcement that prevents crack formation during thermal processing.
3Ease of manufacture
If uniform thickness is used for internal electrodes to simplify manufacturing, then manufacturing ease is improved, but connection reliability deteriorates due to shrinkage
Solution Approach 1:
Instead of using uniform thickness throughout, the internal electrode employs local quality variation with different thicknesses in different regions. This allows the manufacturing process to remain relatively simple while achieving improved connection reliability, as the thickness variation can be implemented through standard lamination techniques with controlled material distribution.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer and including first to fourth portions, first and second external electrodes disposed on the first and second portions, respectively and connected to the first internal electrodes, third and fourth external electrodes disposed on the third and fourth portions, respectively and connected to the second internal electrodes, and a connection electrode disposed in at least one of the first to fourth portions, penetrating the dielectric layer, connecting two first internal electrodes or two internal electrodes adjacent to each other in the first direction. The connection electrode has a plurality of via electrodes laminated in the first direction, and via electrodes adjacent to each other in the first direction among the plurality of via electrodes, are shifted from each other in a direction perpendicular to the first direction.