Multilayer Electrode Structure for Sintering-Stable Connectivity
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face issues with reduced connectivity between internal and external electrodes due to internal electrode contraction during sintering, leading to deteriorated electrical characteristics and radial cracks, as well as hydrogen ion penetration affecting insulation resistance.
Innovation Solution
The use of a multilayer electronic component design with external electrodes featuring a base electrode layer comprising Ni and Pd, and internal electrodes with a higher Pd content in specific regions adjacent to the interface with external electrodes, improving connectivity and preventing hydrogen penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional sintering process is used to form external electrode, then manufacturing process is simple, but internal electrode contracts and connectivity deteriorates
Solution Approach 1:
The patent applies preliminary action by forming the base electrode layer with Ni and Pd particles on the internal electrode surface before the sintering process. This pre-formed layer compensates for the internal electrode contraction that occurs during sintering, maintaining connectivity between internal and external electrodes without requiring complex process modifications.
Solution Approach 2:
The patent uses composite materials by combining Ni and Pd particles in the base electrode layer. Pd provides excellent electrical conductivity and resistance to oxidation, while Ni offers cost-effectiveness and compatibility with the sintering process. This composite structure resolves the contradiction between manufacturing simplicity and electrical reliability.
2Quantity of substance
If Cu is used in external electrode paste, then manufacturing cost is reduced, but Cu diffuses into internal electrode causing volume expansion and stress
Solution Approach 1:
The patent introduces an intermediary barrier by forming the base electrode layer containing Pd particles between the Cu-containing external electrode paste and the internal electrode. Pd acts as a diffusion barrier that prevents Cu from penetrating into the internal electrode during sintering, while still allowing electrical conductivity. This resolves the contradiction between cost reduction and composition stability.
3Reliability
If plating process is used to form base electrode layer, then electrode connectivity is improved, but hydrogen ions penetrate into body reducing insulation resistance
Solution Approach 1:
The patent replaces the electrochemical plating process with a sintering-based formation process for the base electrode layer. Instead of using electroplating which generates hydrogen ions as a byproduct, the invention uses a thermal sintering process that combines Ni and Pd particles to form the conductive layer. This substitution eliminates hydrogen ion generation while maintaining electrode connectivity, resolving the contradiction between improved connectivity and reduced harmful effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrical characteristics by improving electrode connectivity and suppressing radial cracks and hydrogen penetration, ensuring reliable performance even with thinner dielectric layers.
Implementation Method 1
an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd
Implementation Method 2
A conventional multilayer ceramic capacitor is formed by stacking a ceramic green sheet coated with a paste for an internal electrode and then sintering the ceramic green sheet to from a body
Implementation Method 3
during the sintering process, due to the contraction of the internal electrode, the internal electrode may be formed to be recessed into the body
Implementation Method 4
since Cu of the external electrode diffuses into the internal electrode during the sintering process to cause volume expansion of the body and to increase the stress applied to the body
Data Source
AI summary
Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.