Multilayer Electronic Component Electrode Structure Against Interface Lifting
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with weak adhesion between conductive resin and sintered electrode layers, leading to lifting and weak electrical conductivity due to dispersed conductive particles, and are prone to tearing and reliability issues in high-temperature environments like reflow.
Innovation Solution
A multilayer electronic component design featuring an external electrode with an intermetallic compound layer and a conductive resin layer containing a second intermetallic compound, low-melting-point metal, and metal particles, where the ratio of specific components enhances bonding strength and electrical conductivity, preventing lifting and tearing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer with dispersed conductive particles is applied to the external electrode, then electrical connectivity is achieved through hopping conduction, but the electrical conductivity is weak
Solution Approach 1:
The patent creates a composite structure by forming an intermetallic compound layer between the conductive resin layer and the sintered electrode layer. This intermetallic compound layer acts as a bridge that improves electrical connectivity, transforming the simple hopping conduction path into a more efficient conduction path that reduces electrical resistance while maintaining the dispersed particle structure of the conductive resin.
2Strength
If the conductive resin layer is bonded to the sintered electrode layer through resin bonding strength, then adhesion is achieved, but the bonding strength is weak causing lifting at the interface
Solution Approach 1:
The patent introduces an intermetallic compound layer as an intermediary between the conductive resin layer and the sintered electrode layer. This intermediate layer provides strong metallurgical bonding to both sides, replacing the weak resin-to-electrode bonding and preventing interface lifting while maintaining the conductive resin's electrical connectivity function.
Solution Approach 2:
The patent changes the bonding mechanism parameter from resin-to-electrode adhesion to metallurgical bonding through intermetallic compound formation. By controlling the formation of specific intermetallic compounds (such as Cu3Sn, Cu6Sn5, or Ag3Sn), the bonding strength is significantly enhanced, preventing lifting at the interface during reflow processing.
3Strength
If the conductive resin layer has low rigidity to absorb stress, then mechanical stress absorption is improved, but the inside of the conductive resin layer may be torn due to outgassing in high-temperature environments
Solution Approach 1:
The intermetallic compound layer serves as a rigid intermediary that provides structural support to the conductive resin layer. This intermediate layer prevents the conductive resin layer from tearing during outgassing in high-temperature environments while still allowing the resin to absorb mechanical stress, thus maintaining both stress absorption capability and internal structural integrity.
4Reliability
If the conductive resin layer is applied to protect from mechanical and thermal stress, then protection is achieved, but lifting occurs at the interface due to outgassing in high-temperature environments
Solution Approach 1:
The intermetallic compound layer acts as a heat-resistant intermediary that maintains strong bonding between the conductive resin layer and the sintered electrode layer during high-temperature reflow processing. This intermediate layer prevents interface lifting caused by outgassing while preserving the protective function of the conductive resin layer against mechanical and thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the reliability and electrical conductivity of the multilayer electronic component by maintaining bonding strength and preventing interface lifting and tearing in high-temperature environments, ensuring stable performance.
Implementation Method 1
a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal
Implementation Method 2
a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin
Implementation Method 3
The conductive resin layer serves to electrically and mechanically bond a sintered electrode layer and a plating layer of an external electrode
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.